XC7S75-1FGGA676Q

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Mfr.Part #
XC7S75-1FGGA676Q
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 400 I/O 676FBGA
Stock
43,249
In Stock :
43,249

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Position :
BOTTOM
Series :
Spartan®-7
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Surface Mount :
yes
HTS Code :
8542.39.00.01
Operating Temperature :
-40°C~125°C TJ
Width :
27mm
Number of I/O :
400
Supply Voltage :
1V
Terminal Finish :
Matte Tin (Sn)
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
RoHS Status :
ROHS3 Compliant
Number of LABs/CLBs :
6000
Terminal Pitch :
1mm
Total RAM Bits :
4331520
Number of Terminations :
676
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Length :
27mm
Voltage - Supply :
0.95V~1.05V
JESD-30 Code :
S-PBGA-B676
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
JESD-609 Code :
e3
Combinatorial Delay of a CLB-Max :
1.27 ns
Package / Case :
676-BGA
Number of Logic Elements/Cells :
76800
Factory Lead Time :
10 Weeks
Height Seated (Max) :
2.44mm
Terminal Form :
Ball
Datasheets
XC7S75-1FGGA676Q
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7S75-1FGGA676Q from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~125°C TJ, Mounting Type:Surface Mount, Number of Terminations:676, Package / Case:676-BGA, XC7S75-1FGGA676Q pinout, XC7S75-1FGGA676Q datasheet PDF, XC7S75-1FGGA676Q amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7S75-1FGGA676Q ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7S75-1FGGA676Q


FPGAs AMD Xilinx XC7S75-1FGGA676Q Overview

The AMD Xilinx XC7S75-1FGGA676Q is a state-of-the-art FPGA (Field Programmable Gate Array) that delivers exceptional performance and flexibility for a wide range of applications. Designed to meet the demands of modern digital circuits, this FPGA features a robust 676-pin FBGA (Fine Pitch Ball Grid Array) package, ensuring compact and efficient integration into various hardware environments. This product is ideal for designers looking to harness the power of reconfigurable computing with enhanced reliability and high-speed connectivity, making it a top choice for sophisticated electronic systems.

XC7S75-1FGGA676Q Features

This FPGA boasts 400 programmable I/O ports, providing ample flexibility for interfacing with a multitude of peripherals and other digital systems. The high I/O count is crucial for complex designs requiring numerous connections, such as high-speed data transfer devices and multi-functional systems. Its advanced configuration options allow for custom setups tailored to specific needs, enhancing both performance and usability in challenging environments.

XC7S75-1FGGA676Q Applications

  • Data Centers: Utilized in server infrastructure to accelerate data processing and network management tasks, enhancing overall efficiency and throughput.
  • Telecommunications: Deployed in communication hardware for signal processing and management, crucial in base stations and network switches.
  • Automotive: Integral to advanced driver-assistance systems (ADAS) for processing and decision-making tasks, improving vehicle safety and performance.
  • Consumer Electronics: Used in high-performance gaming consoles and home entertainment systems for handling complex graphical and audio processing.
  • Industrial Automation: Key component in control systems for real-time processing and monitoring, vital in manufacturing and automation processes.
This HTML structured content provides an engaging overview, detailed feature list, and specific applications for the XC7S75-1FGGA676Q FPGA, making it attractive and informative for business clients interested in bulk purchasing this advanced component from AMD Xilinx.
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