XC7S75-1FGGA676C

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Mfr.Part #
XC7S75-1FGGA676C
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 400 I/O 676FPBGA
Stock
1
In Stock :
1

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Supply Voltage :
1V
Total RAM Bits :
4331520
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Package / Case :
676-BGA
Surface Mount :
yes
HTS Code :
8542.39.00.01
Number of Terminations :
676
Number of I/O :
400
JESD-30 Code :
S-PBGA-B676
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay of a CLB-Max :
1.27 ns
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
RoHS Status :
ROHS3 Compliant
Terminal Position :
BOTTOM
Series :
Spartan®-7
Operating Temperature :
0°C~85°C TJ
Voltage - Supply :
0.95V~1.05V
Number of LABs/CLBs :
6000
Factory Lead Time :
10 Weeks
Packaging :
Tray
Terminal Form :
Ball
Mounting Type :
Surface Mount
Number of Logic Elements/Cells :
76800
Datasheets
XC7S75-1FGGA676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7S75-1FGGA676C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:676-BGA, Number of Terminations:676, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, XC7S75-1FGGA676C pinout, XC7S75-1FGGA676C datasheet PDF, XC7S75-1FGGA676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7S75-1FGGA676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7S75-1FGGA676C


FPGAs AMD Xilinx XC7S75-1FGGA676C Overview

The FPGAs AMD Xilinx XC7S75-1FGGA676C is a high-performance, field-programmable gate array that provides a flexible and efficient solution for a broad range of applications. Engineered by AMD Xilinx, this FPGA is housed in a 676-pin FBGA package and boasts up to 400 I/O options, making it an excellent choice for developers looking to integrate versatile, high-density logic operations into their designs. Its adaptability and powerful capabilities make it ideally suited for complex digital computations and signal processing tasks, enabling designers to optimize their systems for peak performance and reduced power consumption.

XC7S75-1FGGA676C Features

The XC7S75-1FGGA676C FPGA from AMD Xilinx stands out with its robust feature set designed for high efficiency and scalability. Key features include a 676-pin FBGA packaging that supports intricate board layouts and high-connectivity options. With its substantial I/O capabilities, it can handle multiple simultaneous inputs and outputs, which is critical for high-throughput systems. The flexibility offered by reprogrammable gate arrays allows for rapid prototyping and updates, significantly reducing development time and cost.

XC7S75-1FGGA676C Applications

  • Telecommunications Equipment: This FPGA can be utilized to manage signal processing tasks, such as digital signal processing (DSP) for real-time voice and video data transmission, enhancing both the capacity and quality of telecom infrastructures.
  • Automotive Systems: In automotive technology, the XC7S75-1FGGA676C is applied to control systems and driver assistance features, where quick data processing and responsiveness are crucial for vehicle safety and performance.
  • Data Centers: Due to its high I/O capabilities and flexibility, this FPGA is perfect for use in data centers for managing complex tasks like data flow processing and infrastructure virtualization, ensuring efficient operation and scalability.
  • Industrial Automation: The FPGA excels in automated manufacturing environments, where it can be programmed to handle machine control and robotic operations, leading to improved productivity and operational reliability.
  • Consumer Electronics: It is also widely used in consumer electronics to drive the functionality of smart devices, from high-definition televisions to portable gadgets, by performing essential processing tasks efficiently and effectively.
This structured approach showcases the capabilities and applications of the XC7S75-1FGGA676C, positioning it as a versatile component suited for a wide range of high-tech integrations.
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