XC6SLX75T-4FGG676C

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Mfr.Part #
XC6SLX75T-4FGG676C
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 348 I/O 676FBGA
Stock
45,162
In Stock :
45,162

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
5831
Terminal Form :
Ball
Base Part Number :
XC6SLX75
Series :
Spartan®-6 LXT
Height Seated (Max) :
2.6mm
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Pitch :
1mm
Number of I/O :
348
HTS Code :
8542.39.00.01
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
676-BGA
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RAM Size :
387kB
Mounting Type :
Surface Mount
Reach Compliance Code :
Unknown
Terminal Position :
BOTTOM
JESD-30 Code :
S-PBGA-B676
Power Supplies :
1.22.5/3.3V
Mount :
Surface Mount
Voltage - Supply :
1.14V~1.26V
Qualification Status :
Not Qualified
Width :
27mm
Number of Inputs :
348
Length :
27mm
Number of Logic Elements/Cells :
74637
RoHS Status :
RoHS Compliant
Total RAM Bits :
3170304
Published :
2008
JESD-609 Code :
e1
Packaging :
Tray
Pin Count :
676
Number of Outputs :
348
Number of Terminations :
676
Peak Reflow Temperature (Cel) :
250
Time@Peak Reflow Temperature-Max (s) :
30
Operating Temperature :
0°C~85°C TJ
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX75T-4FGG676C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC6SLX75, Package / Case:676-BGA, Mounting Type:Surface Mount, Number of Terminations:676, Operating Temperature:0°C~85°C TJ, XC6SLX75T-4FGG676C pinout, XC6SLX75T-4FGG676C datasheet PDF, XC6SLX75T-4FGG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX75T-4FGG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6SLX75T-4FGG676C


FPGAs AMD Xilinx XC6SLX75T-4FGG676C Overview

The AMD Xilinx XC6SLX75T-4FGG676C FPGA stands out in the field of programmable logic solutions, offering high-performance capabilities in a compact 676FBGA package. This component is designed to cater to a wide array of applications requiring flexible, customizable hardware solutions that can adapt to varied and changing requirements. The XC6SLX75T-4FGG676C is particularly noted for its integration of 348 I/Os, providing extensive connectivity options and making it an ideal choice for complex digital systems. This FPGA is engineered for designers who need robust, high-speed programmable logic for their computing and processing needs, ensuring efficiency and reliability in demanding environments.

XC6SLX75T-4FGG676C Features

The XC6SLX75T-4FGG676C by AMD Xilinx is equipped with advanced features that enhance its usability and performance in a multitude of electronic applications. These include a large number of input/output ports, a dense 676-pin ball grid array (BGA) package for superior electrical connectivity, and compatibility with Spartan-6 architecture, known for its cost-effective and power-efficient design. This FPGA is designed to support complex digital computations while maintaining low power consumption and high data integrity.

XC6SLX75T-4FGG676C Applications

  • Consumer Electronics: Used in devices such as gaming consoles and high-definition televisions to manage signal processing and enhance user interface functionalities.
  • Telecommunications: Employs in routers and switches for packet processing tasks, enhancing network efficiency and data flow management.
  • Automotive Systems: Integrated into automotive infotainment systems, providing support for complex audio and video processing tasks.
  • Industrial Automation: Crucial in controlling machinery in production lines, improving operational efficiency and reliability through sophisticated control systems.
  • Medical Devices: Utilized in medical imaging systems, such as MRI and ultrasound machines, to process complex imaging data rapidly and accurately.
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