XC6SLX25-N3FG484C

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Mfr.Part #
XC6SLX25-N3FG484C
Manufacturer
AMD Xilinx
Package / Case
484-BBGA
Datasheet
Download
Description
IC FPGA 266 I/O 484FBGA
Stock
33,394
In Stock :
33,394

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Height Seated (Max) :
2.6mm
Terminal Pitch :
1mm
Number of LABs/CLBs :
1879
Terminal Position :
BOTTOM
Number of Terminations :
484
Base Part Number :
XC6SLX25
Peak Reflow Temperature (Cel) :
225
Number of Logic Elements/Cells :
24051
Total RAM Bits :
958464
Width :
23mm
Voltage - Supply :
1.14V~1.26V
Number of Inputs :
266
Mounting Type :
Surface Mount
Qualification Status :
Not Qualified
Combinatorial Delay of a CLB-Max :
0.26 ns
Number of I/O :
266
Power Supplies :
1.21.2/3.32.5/3.3V
Terminal Form :
Ball
Surface Mount :
yes
RoHS Status :
Non-RoHS Compliant
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Clock Frequency :
806MHz
JESD-30 Code :
S-PBGA-B484
Supply Voltage :
1.2V
Published :
2008
Terminal Finish :
Tin/Lead (Sn63Pb37)
Series :
Spartan®-6 LX
Operating Temperature :
0°C~85°C TJ
Time@Peak Reflow Temperature-Max (s) :
30
Package / Case :
484-BBGA
HTS Code :
8542.39.00.01
ECCN Code :
3A991.D
Number of Outputs :
266
JESD-609 Code :
e0
Length :
23mm
Datasheets
XC6SLX25-N3FG484C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX25-N3FG484C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:484, Base Part Number:XC6SLX25, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Package / Case:484-BBGA, XC6SLX25-N3FG484C pinout, XC6SLX25-N3FG484C datasheet PDF, XC6SLX25-N3FG484C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6SLX25-N3FG484C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6SLX25-N3FG484C


FPGAs AMD Xilinx XC6SLX25-N3FG484C Overview

The FPGAs AMD Xilinx XC6SLX25-N3FG484C is an advanced field programmable gate array designed to meet the demands of high-performance, high-density applications across a broad range of industries. Manufactured by AMD Xilinx, a leader in digital design and fabrication, this FPGA boasts a flexible, programmable architecture that allows rapid deployment of custom hardware logic tailored to specific user requirements. Its compact form factor in a 484-ball fine-pitch BGA package makes it ideal for space-constrained applications while providing a robust platform with 266 I/Os for comprehensive connectivity and interfacing options.

XC6SLX25-N3FG484C Features

This IC FPGA model XC6SLX25-N3FG484C by AMD Xilinx offers numerous features that make it an attractive choice for developers and engineers looking for versatility and performance. It includes integrated DSP slices for high-speed numeric processing, ample logic cells for complex designs, and advanced security features for intellectual property protection. Additionally, it supports multiple I/O standards and has low power consumption, enhancing its efficiency for use in both portable and fixed electronic devices.

XC6SLX25-N3FG484C Applications

  • Consumer Electronics: Used in devices like high-definition televisions and gaming consoles, the XC6SLX25-N3FG484C enables sophisticated video processing and rich user interfaces.
  • Automotive: Integral to advanced driver-assistance systems (ADAS), this FPGA processes inputs from multiple sensors for real-time decision making, enhancing vehicle safety and functionality.
  • Telecommunications: Helps in the deployment of next-generation network equipment, supporting complex signal processing tasks required for 5G technologies.
  • Industrial: In industrial automation, the XC6SLX25-N3FG484C controls machinery and processes data from sensors to optimize efficiency and reliability in harsh environments.
  • Medical Devices: Facilitates the development of medical imaging systems like ultrasound and MRI, providing the computational power needed for detailed image processing and analysis.
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