XC2VP70-7FFG1704C

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Mfr.Part #
XC2VP70-7FFG1704C
Manufacturer
AMD Xilinx
Package / Case
1704-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 996 I/O 1704FCBGA
Stock
15,227
In Stock :
15,227

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Logic Elements/Cells :
74448
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Pitch :
1mm
Terminal Finish :
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Series :
Virtex®-II Pro
Height Seated (Max) :
3.45mm
RAM Size :
738kB
Time@Peak Reflow Temperature-Max (s) :
30
Clock Frequency :
1350MHz
Terminal Position :
BOTTOM
Speed Grade :
7
Mount :
Surface Mount
HTS Code :
8542.39.00.01
Factory Lead Time :
6 Weeks
Qualification Status :
Not Qualified
Mounting Type :
Surface Mount
Power Supplies :
1.51.5/3.32/2.52.5V
Operating Temperature :
0°C~85°C TJ
Pbfree Code :
yes
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
RoHS Status :
ROHS3 Compliant
Combinatorial Delay of a CLB-Max :
0.28 ns
Number of Outputs :
996
Package / Case :
1704-BBGA, FCBGA
Number of LABs/CLBs :
8272
Length :
42.5mm
Published :
2011
Base Part Number :
XC2VP70
JESD-609 Code :
e1
Total RAM Bits :
6045696
Operating Supply Voltage :
1.5V
Peak Reflow Temperature (Cel) :
245
Supply Voltage :
1.5V
Reach Compliance Code :
not_compliant
Terminal Form :
Ball
Number of Pins :
1704
Packaging :
Tray
Number of I/O :
996
Voltage - Supply :
1.425V~1.575V
Width :
42.5mm
Number of Registers :
66176
Datasheets
XC2VP70-7FFG1704C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP70-7FFG1704C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Package / Case:1704-BBGA, FCBGA, Base Part Number:XC2VP70, Number of Pins:1704, XC2VP70-7FFG1704C pinout, XC2VP70-7FFG1704C datasheet PDF, XC2VP70-7FFG1704C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP70-7FFG1704C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.5V V 3.45mm mm FPGAs Virtex®-II Pro Series 1704-BBGA, FCBGA 1mm mm

XC2VP70-7FFG1704C Overview


This package is included in the 1704-BBGA, FCBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. 1.5V volts power it. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 1.425V~1.575V . An FPGA belonging to the Virtex®-II Pro series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. With this device, you will be able to make use of 996 outputs. Using the Tray layout, this FPGA model can be contained in a very small amount of space. This device is equipped with 6045696 RAM bits in terms of its RAM si6045696e. Parts related to this part can be found using its base part number XC2VP70. During the configuration of this FPGA module, the RAM si738kBe reaches 738kB to ensure that the program runs normally. The device is designed with 1704 pins in total. An array of 8272 LABs/CLBs is built into the FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.5V supply voltage, designers can take full advantage of its flexibility. It is powered by a 1.51.5/3.32/2.52.5V battery, which can be purchased separately. A crystal oscillating at 1350MHz is one of the most common components of this device. A total of 66176 registers are used for storing and transferring data between them.

XC2VP70-7FFG1704C Features


996 I/Os
Up to 6045696 RAM bits
1704 LABs/CLBs
66176 registers


XC2VP70-7FFG1704C Applications


There are a lot of Xilinx Inc.
XC2VP70-7FFG1704C FPGAs applications.


  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
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