XC2V1000-5BGG575I
- Mfr.Part #
- XC2V1000-5BGG575I
- Manufacturer
- AMD Xilinx
- Package / Case
- 575-BBGA
- Datasheet
- Download
- Description
- IC FPGA 328 I/O 575BGA
- Stock
- 323
- In Stock :
- 323
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Published :
- 2007
- Combinatorial Delay of a CLB-Max :
- 0.39 ns
- Terminal Form :
- Ball
- Packaging :
- Tray
- Operating Temperature :
- -40°C~100°C TJ
- RAM Size :
- 90kB
- Number of Registers :
- 10240
- Supply Voltage :
- 1.5V
- RoHS Status :
- RoHS Compliant
- Base Part Number :
- XC2V1000
- Pin Count :
- 575
- Radiation Hardening :
- No
- Height Seated (Max) :
- 2.6mm
- Mounting Type :
- Surface Mount
- Number of Outputs :
- 328
- Number of Gates :
- 1000000
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Series :
- Virtex®-II
- Terminal Position :
- BOTTOM
- Peak Reflow Temperature (Cel) :
- 250
- Speed Grade :
- 5
- Width :
- 31mm
- Total RAM Bits :
- 737280
- Length :
- 31mm
- Number of Terminations :
- 575
- Number of I/O :
- 328
- JESD-609 Code :
- e1
- Pbfree Code :
- yes
- Operating Supply Voltage :
- 1.5V
- Number of Pins :
- 575
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Number of LABs/CLBs :
- 1280
- ECCN Code :
- EAR99
- Voltage - Supply :
- 1.425V~1.575V
- Mount :
- Surface Mount
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch :
- 1.27mm
- Package / Case :
- 575-BBGA
- Datasheets
- XC2V1000-5BGG575I

FPGAs AMD Xilinx XC2V1000-5BGG575I Overview
The FPGAs AMD Xilinx XC2V1000-5BGG575I is a high-performance, field-programmable gate array designed to meet the demands of advanced digital processing. This integrated circuit, housed in a 575-pin BGA (ball grid array) package, is engineered to provide a flexible, efficient solution for hardware acceleration in various computing environments. Featuring robust I/O capabilities with 328 I/O pins, this FPGA is an ideal choice for developers looking to implement complex digital logic circuits while maintaining low latency and high throughput. Its versatility makes it a critical component in sectors requiring high-speed data processing and customizable logic solutions.
XC2V1000-5BGG575I Features
- 575 BGA package: Compact and robust packaging for high-density board designs.
- 328 I/O pins: Extensive interfacing capabilities with other components and systems.
- Scalable FPGA architecture: Allows for flexible system design and integration.
XC2V1000-5BGG575I Applications
- Telecommunications Equipment: Utilized in routers and switches for packet processing, improving bandwidth and reducing latency.
- Automotive Systems: Enhances functionality in driver assistance systems by accelerating real-time data processing.
- Data Centers: Key component in data storage and retrieval systems, facilitating high-speed data operations and cloud computing services.
- Consumer Electronics: Applied in smart home devices and entertainment systems to enhance user interfaces and multimedia processing.
- Industrial Automation: Used in control systems to optimize process automation and real-time monitoring capabilities.
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