XC2V1000-5BGG575I

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Mfr.Part #
XC2V1000-5BGG575I
Manufacturer
AMD Xilinx
Package / Case
575-BBGA
Datasheet
Download
Description
IC FPGA 328 I/O 575BGA
Stock
323
In Stock :
323

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Published :
2007
Combinatorial Delay of a CLB-Max :
0.39 ns
Terminal Form :
Ball
Packaging :
Tray
Operating Temperature :
-40°C~100°C TJ
RAM Size :
90kB
Number of Registers :
10240
Supply Voltage :
1.5V
RoHS Status :
RoHS Compliant
Base Part Number :
XC2V1000
Pin Count :
575
Radiation Hardening :
No
Height Seated (Max) :
2.6mm
Mounting Type :
Surface Mount
Number of Outputs :
328
Number of Gates :
1000000
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
Virtex®-II
Terminal Position :
BOTTOM
Peak Reflow Temperature (Cel) :
250
Speed Grade :
5
Width :
31mm
Total RAM Bits :
737280
Length :
31mm
Number of Terminations :
575
Number of I/O :
328
JESD-609 Code :
e1
Pbfree Code :
yes
Operating Supply Voltage :
1.5V
Number of Pins :
575
Time@Peak Reflow Temperature-Max (s) :
40
Number of LABs/CLBs :
1280
ECCN Code :
EAR99
Voltage - Supply :
1.425V~1.575V
Mount :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Pitch :
1.27mm
Package / Case :
575-BBGA
Datasheets
XC2V1000-5BGG575I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V1000-5BGG575I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Base Part Number:XC2V1000, Mounting Type:Surface Mount, Number of Terminations:575, Number of Pins:575, Package / Case:575-BBGA, XC2V1000-5BGG575I pinout, XC2V1000-5BGG575I datasheet PDF, XC2V1000-5BGG575I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V1000-5BGG575I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V1000-5BGG575I


FPGAs AMD Xilinx XC2V1000-5BGG575I Overview

The FPGAs AMD Xilinx XC2V1000-5BGG575I is a high-performance, field-programmable gate array designed to meet the demands of advanced digital processing. This integrated circuit, housed in a 575-pin BGA (ball grid array) package, is engineered to provide a flexible, efficient solution for hardware acceleration in various computing environments. Featuring robust I/O capabilities with 328 I/O pins, this FPGA is an ideal choice for developers looking to implement complex digital logic circuits while maintaining low latency and high throughput. Its versatility makes it a critical component in sectors requiring high-speed data processing and customizable logic solutions.

XC2V1000-5BGG575I Features

  • 575 BGA package: Compact and robust packaging for high-density board designs.
  • 328 I/O pins: Extensive interfacing capabilities with other components and systems.
  • Scalable FPGA architecture: Allows for flexible system design and integration.

XC2V1000-5BGG575I Applications

  • Telecommunications Equipment: Utilized in routers and switches for packet processing, improving bandwidth and reducing latency.
  • Automotive Systems: Enhances functionality in driver assistance systems by accelerating real-time data processing.
  • Data Centers: Key component in data storage and retrieval systems, facilitating high-speed data operations and cloud computing services.
  • Consumer Electronics: Applied in smart home devices and entertainment systems to enhance user interfaces and multimedia processing.
  • Industrial Automation: Used in control systems to optimize process automation and real-time monitoring capabilities.
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