XC2V1000-4BGG575C

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Mfr.Part #
XC2V1000-4BGG575C
Manufacturer
AMD Xilinx
Package / Case
575-BBGA
Datasheet
Download
Description
IC FPGA 328 I/O 575BGA
Stock
20,589
In Stock :
20,589

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Height Seated (Max) :
2.6mm
Number of Registers :
10240
Pbfree Code :
yes
Base Part Number :
XC2V1000
Packaging :
Tray
Number of Gates :
1000000
Radiation Hardening :
No
Package / Case :
575-BBGA
Lead Free :
Lead Free
Width :
31mm
Operating Supply Voltage :
1.5V
ECCN Code :
EAR99
Number of LABs/CLBs :
1280
Mounting Type :
Surface Mount
Total RAM Bits :
737280
Time@Peak Reflow Temperature-Max (s) :
40
Mount :
Surface Mount
Number of Pins :
575
Number of Terminations :
575
Supply Voltage :
1.5V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Length :
31mm
Operating Temperature :
0°C~85°C TJ
Terminal Pitch :
1.27mm
Pin Count :
575
JESD-609 Code :
e1
Power Supplies :
1.51.5/3.33.3V
Published :
2007
Number of Outputs :
328
Peak Reflow Temperature (Cel) :
250
Speed Grade :
4
RAM Size :
90kB
Voltage - Supply :
1.425V~1.575V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Clock Frequency :
650MHz
RoHS Status :
RoHS Compliant
Series :
Virtex®-II
Terminal Position :
BOTTOM
Number of I/O :
328
Number of Logic Cells :
11520
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V1000-4BGG575C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC2V1000, Package / Case:575-BBGA, Mounting Type:Surface Mount, Number of Pins:575, Number of Terminations:575, Operating Temperature:0°C~85°C TJ, XC2V1000-4BGG575C pinout, XC2V1000-4BGG575C datasheet PDF, XC2V1000-4BGG575C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V1000-4BGG575C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V1000-4BGG575C


FPGAs AMD Xilinx XC2V1000-4BGG575C Overview

The FPGAs AMD Xilinx XC2V1000-4BGG575C is a high-performance, field-programmable gate array designed for versatile and complex digital systems. Manufactured by AMD Xilinx, a leader in digital design technology, this FPGA stands out due to its robust feature set which includes 328 I/Os housed in a compact 575-ball grid array (BGA) package. It offers an excellent platform for developers looking to leverage flexibility and high-speed performance for next-generation electronic applications. With its advanced system features and scalability, the XC2V1000-4BGG575C is ideal for addressing demanding processing tasks, enabling efficient and rapid development cycles in various tech-intensive sectors.

XC2V1000-4BGG575C Features

This FPGA module integrates multiple advanced features to support a wide range of applications. Key features include a large number of input/output pins (328 I/Os) for extensive connectivity options, a 575-ball BGA package that minimizes space while maximizing reliability and thermal management, and the capacity to handle complex digital computations. These features make the XC2V1000-4BGG575C an excellent choice for developers looking for a high-grade programmable solution.

XC2V1000-4BGG575C Applications

  • Telecommunications: Utilized in routers and switchers for managing data traffic efficiently.
  • Automotive: Can be embedded in driver assistance systems, where real-time processing is crucial.
  • Consumer Electronics: Forms the backbone of complex multimedia systems and high-definition video processing units.
  • Industrial: Employed in control systems and automation processes, offering robust operation and adaptability in harsh environments.
  • Medical Devices: Key in the development of medical imaging devices and diagnostic equipment, ensuring rapid processing and reliability.
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