XC2VP70-6FFG1517C
- Mfr.Part #
- XC2VP70-6FFG1517C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 964 I/O 1517FCBGA
- Stock
- 11,643
- In Stock :
- 11,643
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of I/O :
- 964
- Mount :
- Surface Mount
- Lead Free :
- Lead Free
- Factory Lead Time :
- 6 Weeks
- Number of Outputs :
- 964
- Terminal Pitch :
- 1mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- ECCN Code :
- 3A001.A.7.A
- Number of Registers :
- 66176
- Voltage - Supply :
- 1.425V~1.575V
- HTS Code :
- 8542.39.00.01
- Published :
- 2005
- Total RAM Bits :
- 6045696
- Number of Pins :
- 1517
- RoHS Status :
- ROHS3 Compliant
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel) :
- 245
- Package / Case :
- 1517-BBGA, FCBGA
- Pbfree Code :
- yes
- Number of Logic Elements/Cells :
- 74448
- Terminal Position :
- BOTTOM
- Operating Supply Voltage :
- 1.5V
- Clock Frequency :
- 1200MHz
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Mounting Type :
- Surface Mount
- Length :
- 40mm
- JESD-609 Code :
- e1
- Reach Compliance Code :
- not_compliant
- Number of LABs/CLBs :
- 8272
- Base Part Number :
- XC2VP70
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Height Seated (Max) :
- 3.4mm
- Width :
- 40mm
- Combinatorial Delay of a CLB-Max :
- 0.32 ns
- Qualification Status :
- Not Qualified
- Packaging :
- Tray
- RAM Size :
- 738kB
- Speed Grade :
- 6
- Power Supplies :
- 1.51.5/3.32/2.52.5V
- Series :
- Virtex®-II Pro
- Terminal Form :
- Ball
- Supply Voltage :
- 1.5V
- Datasheets
- XC2VP70-6FFG1517C

FPGAs AMD Xilinx XC2VP70-6FFG1517C Overview
The AMD Xilinx XC2VP70-6FFG1517C FPGA is a high-performance, field-programmable gate array that delivers exceptional processing capabilities suitable for a wide range of demanding applications. Designed to meet the rigorous needs of modern technology environments, this FPGA combines versatility with high functionality to support complex digital processing tasks. Its 1517-pin flip-chip BGA (FCBGA) package ensures robust physical connectivity, making it an ideal choice for projects requiring a reliable, high-density integration solution. The XC2VP70-6FFG1517C excels in environments where speed and adaptability are paramount, providing designers the flexibility to tailor the configuration to specific project requirements.
XC2VP70-6FFG1517C Features
The XC2VP70-6FFG1517C from AMD Xilinx boasts a range of features that enhance its utility in high-tech applications. It includes 964 programmable I/O ports, offering expansive connectivity options for peripheral devices. This FPGA is engineered to support intricate digital designs with its advanced logic and memory capabilities, facilitating the development of both simple and complex system architectures. The robust package design and advanced thermal management features ensure reliable performance under various operational conditions.
XC2VP70-6FFG1517C Applications
- Data Centers: Utilized in server farms and networking infrastructures to manage data flow efficiently, ensuring high-speed data processing and improved bandwidth allocation.
- Telecommunications: Essential in the development of telecommunications hardware, such as switches and routers, which require high levels of data throughput and signal integrity.
- Automotive Systems: Incorporated in advanced driver-assistance systems (ADAS) to facilitate real-time sensor data processing and decision-making in vehicular technologies.
- Industrial Automation: Plays a crucial role in the control systems of automated manufacturing lines, enhancing precision and productivity through improved control logic.
- Consumer Electronics: Used in high-performance gaming consoles and home entertainment systems to handle complex graphics processing and user interface management.
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