XC2VP70-6FF1517C
- Mfr.Part #
- XC2VP70-6FF1517C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 964 I/O 1517FCBGA
- Stock
- 11,912
- In Stock :
- 11,912
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Operating Temperature :
- 0°C~85°C TJ
- Surface Mount :
- yes
- Combinatorial Delay of a CLB-Max :
- 0.32 ns
- Number of LABs/CLBs :
- 8272
- Series :
- Virtex®-II Pro
- Number of I/O :
- 964
- Voltage - Supply :
- 1.425V~1.575V
- Terminal Position :
- BOTTOM
- Operating Supply Voltage :
- 1.5V
- Clock Frequency :
- 1200MHz
- Number of Outputs :
- 964
- Factory Lead Time :
- 6 Weeks
- Pbfree Code :
- No
- Mounting Type :
- Surface Mount
- Length :
- 40mm
- Peak Reflow Temperature (Cel) :
- 225
- JESD-609 Code :
- e0
- Number of Registers :
- 66176
- HTS Code :
- 8542.39.00.01
- Packaging :
- Bulk
- Published :
- 2011
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells :
- 74448
- Speed Grade :
- 6
- Width :
- 40mm
- Terminal Form :
- Ball
- Total RAM Bits :
- 6045696
- RAM Size :
- 738kB
- Reach Compliance Code :
- not_compliant
- JESD-30 Code :
- S-PBGA-B1517
- Height Seated (Max) :
- 3.4mm
- Terminal Pitch :
- 1mm
- Package / Case :
- 1517-BBGA, FCBGA
- RoHS Status :
- Non-RoHS Compliant
- Qualification Status :
- Not Qualified
- ECCN Code :
- 3A001.A.7.A
- Supply Voltage :
- 1.5V
- Power Supplies :
- 1.51.5/3.32/2.52.5V
- Number of Inputs :
- 964
- Datasheets
- XC2VP70-6FF1517C

FPGAs AMD Xilinx XC2VP70-6FF1517C Overview
The FPGAs AMD Xilinx XC2VP70-6FF1517C is a highly versatile field-programmable gate array designed to meet the rigorous demands of modern digital circuits. Manufactured by AMD Xilinx, this IC features a dense layout of 1517 flip-chip ball grid array (FCBGA) package and supports a vast array of 964 I/O pins, making it ideal for complex, multi-functional systems. The FPGA’s robust configurability and scalability make it perfectly suited for developers looking to leverage a single chip for multiple product designs, enhancing both time-to-market and cost-effectiveness. Its integration capabilities serve a broad spectrum of applications, from high-speed networking to real-time processing, where performance and reliability are paramount.
XC2VP70-6FF1517C Features
This FPGA stands out with its extensive I/O capability and high-density integration. The 964 I/Os provide ample flexibility in system design, allowing for a wide range of peripherals and functionalities to be added. The 1517FCBGA packaging ensures a compact form factor while still accommodating a vast network of connections, which is crucial for advanced embedded systems that require a high degree of miniaturization and precise electrical performance.
XC2VP70-6FF1517C Applications
- Telecommunications: Utilized in routers and switches, the XC2VP70-6FF1517C facilitates high-speed data transmission and efficient signal processing which are essential in modern telecom infrastructures.
- Automotive Electronics: This FPGA can manage multiple functionalities in advanced driver-assistance systems (ADAS), enhancing vehicle safety and performance through rapid data processing and response.
- Consumer Electronics: Ideal for use in high-performance home entertainment systems, such as smart TVs and gaming consoles, where processing power and the ability to handle multiple simultaneous inputs and outputs are critical.
- Industrial Automation: In automation and control systems, the XC2VP70-6FF1517C's robust processing capabilities help in managing complex operations, ensuring high reliability and operational efficiency.
- Aerospace and Defense: Employed in systems requiring high levels of security and data integrity, this FPGA supports advanced cryptographic algorithms and secure communications, key to modern defense applications.
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