XC2VP7-6FF672I
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- Mfr.Part #
- XC2VP7-6FF672I
- Manufacturer
- AMD Xilinx
- Package / Case
- 672-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 396 I/O 672FCBGA
- Stock
- 37,897
- In Stock ：
- 37,897
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Position :
- BOTTOM
- Operating Temperature :
- -40°C~100°C TJ
- Terminal Pitch :
- 1mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- ECCN Code :
- 3A991.D
- RAM Size :
- 99kB
- Operating Supply Voltage :
- 1.5V
- Factory Lead Time :
- 6 Weeks
- Number of Terminations :
- 672
- Width :
- 27mm
- Number of I/O :
- 396
- Length :
- 27mm
- Base Part Number :
- XC2VP7
- Pin Count :
- 672
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Power Supplies :
- 1.51.5/3.32/2.52.5V
- HTS Code :
- 8542.39.00.01
- Supply Voltage :
- 1.5V
- Pbfree Code :
- No
- Clock Frequency :
- 1200MHz
- Voltage - Supply :
- 1.425V~1.575V
- Series :
- Virtex®-II Pro
- Number of Pins :
- 672
- Mount :
- Surface Mount
- Number of Outputs :
- 396
- Published :
- 2011
- Packaging :
- Tray
- JESD-609 Code :
- e0
- Number of Registers :
- 9856
- RoHS Status :
- Non-RoHS Compliant
- Speed Grade :
- 6
- Total RAM Bits :
- 811008
- Number of Logic Elements/Cells :
- 11088
- Number of LABs/CLBs :
- 1232
- Mounting Type :
- Surface Mount
- Combinatorial Delay of a CLB-Max :
- 0.32 ns
- Package / Case :
- 672-BBGA, FCBGA
- Peak Reflow Temperature (Cel) :
- 225
- Datasheets
- XC2VP7-6FF672I
XC2VP7-6FF672I Documents
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FPGAs AMD Xilinx XC2VP7-6FF672I Overview
The FPGAs AMD Xilinx XC2VP7-6FF672I is a high-performance Field Programmable Gate Array designed by AMD Xilinx, tailored for advanced applications requiring variable programming and high-speed digital processing. This IC FPGA model, encapsulated in a 672-pin Fine-Pitch Ball Grid Array (FCBGA) package, supports 396 I/Os, making it highly versatile in a range of demanding environments. With its robust configuration options and scalability, the XC2VP7-6FF672I is engineered to meet the critical demands of sophisticated electronic systems, providing designers with the flexibility to innovate and optimize their products efficiently. Its extensive input/output capabilities allow for flexible integration into complex hardware layouts, ensuring that it meets the diverse needs of modern technology landscapes.
XC2VP7-6FF672I Features
The XC2VP7-6FF672I FPGA from AMD Xilinx is equipped with an array of features suitable for high-performance computing environments. It offers a substantial number of I/O ports, a dense 672FCBGA packaging format for reduced footprint on hardware designs, and is built for industrial-grade applications requiring high reliability and endurance. The device is optimized for low power consumption while maintaining superior speed, supporting intricate digital computations and signal processing tasks efficiently.
XC2VP7-6FF672I Applications
- Data Centers: Utilized for managing high-speed data processing and storage solutions, enhancing scalability and efficiency in server infrastructures.
- Telecommunications: Integral in the development of telecommunications hardware, such as routers and switchers, for improved data transfer rates and network reliability.
- Automotive Technology: Applied in driver assistance systems and in-vehicle infotainment systems, contributing to safer and more enjoyable driving experiences.
- Medical Devices: Key component in medical imaging devices like MRI and ultrasound equipment, aiding in high-precision diagnostics and treatments.
- Aerospace and Defense: Employed in navigation systems and avionic controls, ensuring robust performance and reliability under extreme conditions.
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