XC2VP50-7FFG1152C
- Mfr.Part #
- XC2VP50-7FFG1152C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 692 I/O 1152FCBGA
- Stock
- 8,690
- In Stock :
- 8,690
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of I/O :
- 692
- Voltage - Supply :
- 1.425V~1.575V
- ECCN Code :
- 3A991.D
- Total RAM Bits :
- 4276224
- Terminal Position :
- BOTTOM
- Combinatorial Delay of a CLB-Max :
- 0.28 ns
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Packaging :
- Tray
- Package / Case :
- 1152-BBGA, FCBGA
- Height Seated (Max) :
- 3.4mm
- Base Part Number :
- XC2VP50
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Qualification Status :
- Not Qualified
- Width :
- 35mm
- Reach Compliance Code :
- not_compliant
- Terminal Form :
- Ball
- Length :
- 35mm
- Number of Pins :
- 1152
- Number of Logic Elements/Cells :
- 53136
- Power Supplies :
- 1.51.5/3.32/2.52.5V
- Factory Lead Time :
- 6 Weeks
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Registers :
- 47232
- Series :
- Virtex®-II Pro
- JESD-609 Code :
- e1
- Mount :
- Surface Mount
- Number of LABs/CLBs :
- 5904
- HTS Code :
- 8542.39.00.01
- Supply Voltage :
- 1.5V
- RoHS Status :
- ROHS3 Compliant
- Number of Outputs :
- 692
- Published :
- 2011
- Peak Reflow Temperature (Cel) :
- 245
- Mounting Type :
- Surface Mount
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Speed Grade :
- 7
- Pbfree Code :
- yes
- Terminal Pitch :
- 1mm
- RAM Size :
- 522kB
- Clock Frequency :
- 1350MHz
- Operating Supply Voltage :
- 1.5V
- Datasheets
- XC2VP50-7FFG1152C
FPGAs AMD Xilinx XC2VP50-7FFG1152C Overview
The FPGAs AMD Xilinx XC2VP50-7FFG1152C is a highly capable integrated circuit designed for demanding applications requiring high-speed, high-density logic operations. Manufactured by AMD Xilinx, this FPGA features a flexible architecture that supports a wide range of configurations and is packaged in a 1152-pin flip-chip ball grid array (FCBGA). This product is optimized for performance and scalability, making it an ideal solution for designers looking to leverage superior programmability in their digital circuit designs.
XC2VP50-7FFG1152C Features
This FPGA model is designed to meet the rigorous demands of modern digital circuits with its 692 user I/Os which facilitate extensive connectivity options. Its large logic capacity allows for the implementation of complex digital systems on a single chip, greatly reducing system latency and enhancing overall system reliability. The 1152FCBGA packaging ensures robust physical integration while providing excellent thermal management and reduced footprint on the circuit board.
XC2VP50-7FFG1152C Applications
- Data Centers: Utilized for managing data flow and processing tasks, enhancing efficiency and reducing operational costs through accelerated data handling capabilities.
- Telecommunications: Supports the infrastructure for high-speed communication networks by facilitating improved signal processing and bandwidth management.
- Automotive Systems: Critical in advanced driver-assistance systems (ADAS), providing the necessary computational power to process real-time inputs from multiple sensors.
- Medical Imaging: Applied in complex medical imaging systems such as MRI and ultrasound equipment for faster data processing and enhanced image resolution.
- Industrial Automation: Drives automation in manufacturing processes through customizable logic solutions that improve control systems and operational efficiency.
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