XC2VP40-6FGG676C
- Mfr.Part #
- XC2VP40-6FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 416 I/O 676FBGA
- Stock
- 37,513
- In Stock :
- 37,513
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Power Supplies :
- 1.51.5/3.32/2.52.5V
- RoHS Status :
- ROHS3 Compliant
- Clock Frequency :
- 1200MHz
- Number of I/O :
- 416
- Packaging :
- Tray
- ECCN Code :
- 3A991.D
- Total RAM Bits :
- 3538944
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage :
- 1.5V
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Position :
- BOTTOM
- Number of LABs/CLBs :
- 4848
- Length :
- 27mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Width :
- 27mm
- Series :
- Virtex®-II Pro
- Combinatorial Delay of a CLB-Max :
- 0.32 ns
- JESD-609 Code :
- e1
- Number of Outputs :
- 416
- Number of Pins :
- 676
- Number of Registers :
- 38784
- RAM Size :
- 432kB
- Peak Reflow Temperature (Cel) :
- 250
- Published :
- 2011
- Pbfree Code :
- yes
- Voltage - Supply :
- 1.425V~1.575V
- Operating Supply Voltage :
- 1.5V
- HTS Code :
- 8542.39.00.01
- Number of Logic Elements/Cells :
- 43632
- Package / Case :
- 676-BGA
- Factory Lead Time :
- 6 Weeks
- Height Seated (Max) :
- 2.44mm
- Terminal Form :
- Ball
- Qualification Status :
- Not Qualified
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Speed Grade :
- 6
- Number of Terminations :
- 676
- Mounting Type :
- Surface Mount
- Pin Count :
- 676
- Base Part Number :
- XC2VP40
- Terminal Pitch :
- 1mm
- Mount :
- Surface Mount
- Datasheets
- XC2VP40-6FGG676C
FPGAs AMD Xilinx XC2VP40-6FGG676C Overview
The FPGAs AMD Xilinx XC2VP40-6FGG676C is a high-performance, field-programmable gate array designed by AMD Xilinx, a leader in digital design technology. This FPGA is engineered to meet the demanding requirements of modern digital circuits, offering a robust solution for developers looking to deploy complex logic circuits and system designs. With its large number of I/O pins and substantial logic capacity, this component is particularly suitable for applications requiring high-speed data processing and versatile configuration options. Its integration in a 676-pin FBGA package allows for efficient space utilization and improved thermal performance, making it an excellent choice for advanced digital applications.
XC2VP40-6FGG676C Features
This FPGA boasts 416 I/O options providing extensive connectivity and flexibility in system design. Housed in a 676-pin fine pitch ball grid array (FBGA), the XC2VP40-6FGG676C supports high-density system integration while maintaining a compact footprint. This device is particularly noted for its enhanced configuration logic blocks, high-speed DSP capabilities, and advanced memory architecture, facilitating efficient data handling and processing.
XC2VP40-6FGG676C Applications
- Telecommunications: Utilized in networking hardware to manage data flow and signal processing, enhancing communication speed and reliability.
- Automotive Systems: Deployed in advanced driver-assistance systems (ADAS) for real-time sensor data processing and decision-making functionalities.
- Consumer Electronics: Integrated into smart home devices for managing complex user inputs and connectivity with other home automation systems.
- Industrial Automation: Used in control systems for manufacturing processes, optimizing operational efficiency and machine-to-machine communication.
- Medical Devices: Forms the core of imaging systems and diagnostic equipment, offering the necessary speed and precision for critical medical applications.
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