XC2VP40-6FG676C

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Mfr.Part #
XC2VP40-6FG676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 416 I/O 676FCBGA
Stock
30,775
In Stock :
30,775

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Peak Reflow Temperature (Cel) :
225
Total RAM Bits :
3538944
Clock Frequency :
1200MHz
Height Seated (Max) :
2.44mm
Combinatorial Delay of a CLB-Max :
0.32 ns
Number of Logic Elements/Cells :
43632
RAM Size :
432kB
Factory Lead Time :
6 Weeks
RoHS Status :
Non-RoHS Compliant
Speed Grade :
6
Number of Inputs :
416
Reach Compliance Code :
not_compliant
Width :
27mm
JESD-609 Code :
e0
Length :
27mm
Terminal Position :
BOTTOM
Number of Registers :
38784
ECCN Code :
3A991.D
Number of Terminations :
676
Contact Plating :
Lead, Tin
Voltage - Supply :
1.425V~1.575V
Operating Temperature :
0°C~85°C TJ
Terminal Form :
Ball
Series :
Virtex®-II Pro
Moisture Sensitivity Level (MSL) :
2A (4 Weeks)
Number of Outputs :
416
Supply Voltage :
1.5V
Pbfree Code :
No
Qualification Status :
Not Qualified
Mounting Type :
Surface Mount
Packaging :
Bulk
Operating Supply Voltage :
1.5V
Mount :
Surface Mount
Number of LABs/CLBs :
4848
Published :
2011
Pin Count :
676
Package / Case :
676-BBGA, FCBGA
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Pitch :
1mm
Time@Peak Reflow Temperature-Max (s) :
30
Number of I/O :
416
HTS Code :
8542.39.00.01
Datasheets
XC2VP40-6FG676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP40-6FG676C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:676, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Package / Case:676-BBGA, FCBGA, XC2VP40-6FG676C pinout, XC2VP40-6FG676C datasheet PDF, XC2VP40-6FG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP40-6FG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2VP40-6FG676C


FPGAs AMD Xilinx XC2VP40-6FG676C Overview

The FPGas AMD Xilinx XC2VP40-6FG676C is a state-of-the-art integrated circuit specifically engineered by AMD Xilinx to address the complex needs of modern digital systems. This high-performance Field Programmable Gate Array (FPGA) is designed to deliver exceptional processing capabilities in a compact 676-pin flip-chip ball grid array (FCBGA) package. Ideal for applications requiring high-speed data processing and flexible hardware configuration, the XC2VP40-6FG676C stands out for its robust I/O capacity and versatile programmability, ensuring that it meets the evolving demands of technology sectors seeking efficient, scalable solutions.

XC2VP40-6FG676C Features

This FPGA boasts a comprehensive set of features designed to enhance performance and facilitate development. Key attributes include its 416 I/O pins, providing ample connectivity for a variety of peripherals and interfaces. Additionally, the device's high integration supports complex digital systems without the need for multiple chips, reducing overall system cost and increasing reliability.

XC2VP40-6FG676C Applications

  • Data Centers: Utilized for managing complex data processing tasks, improving efficiency and speed in server operations and network management.
  • Telecommunications: Essential for infrastructure, facilitating improved signal processing capabilities and supporting advanced communication protocols.
  • Automotive: Applied in driver assistance systems and in-vehicle infotainment (IVI), enhancing both safety and user experience.
  • Industrial Automation: Increases the performance and flexibility of control systems, capable of handling sophisticated automation tasks.
  • Consumer Electronics: Used in high-performance gaming consoles and home entertainment systems, delivering enhanced graphics and processing power.
This HTML structure segments the product overview, features, and applications into clearly defined sections, each addressing different aspects of the XC2VP40-6FG676C FPGA, while strategically positioning it for B2B customer interest and potential bulk purchasing decisions.
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