XC2VP30-7FFG1152C
- Mfr.Part #
- XC2VP30-7FFG1152C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 644 I/O 1152FCBGA
- Stock
- 28,053
- In Stock :
- 28,053
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Pbfree Code :
- yes
- ECCN Code :
- 3A991.D
- Number of Pins :
- 1152
- Terminal Form :
- Ball
- Series :
- Virtex®-II Pro
- Number of Logic Elements/Cells :
- 30816
- Package / Case :
- 1152-BBGA, FCBGA
- Qualification Status :
- Not Qualified
- Packaging :
- Tray
- Speed Grade :
- 7
- Number of Outputs :
- 644
- Number of LABs/CLBs :
- 3424
- Power Supplies :
- 1.51.5/3.32/2.52.5V
- Operating Temperature :
- 0°C~85°C TJ
- Base Part Number :
- XC2VP30
- Terminal Position :
- BOTTOM
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch :
- 1mm
- Combinatorial Delay of a CLB-Max :
- 0.28 ns
- Operating Supply Voltage :
- 1.5V
- Width :
- 35mm
- JESD-609 Code :
- e1
- Voltage - Supply :
- 1.425V~1.575V
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Peak Reflow Temperature (Cel) :
- 245
- Supply Voltage :
- 1.5V
- HTS Code :
- 8542.39.00.01
- Total RAM Bits :
- 2506752
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Published :
- 2011
- Number of I/O :
- 644
- Height Seated (Max) :
- 3.4mm
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Factory Lead Time :
- 6 Weeks
- Mount :
- Surface Mount
- Number of Registers :
- 27392
- Length :
- 35mm
- RAM Size :
- 306kB
- Clock Frequency :
- 1350MHz
- Reach Compliance Code :
- not_compliant
- Datasheets
- XC2VP30-7FFG1152C
FPGAs AMD Xilinx XC2VP30-7FFG1152C Overview
The AMD Xilinx XC2VP30-7FFG1152C represents a cutting-edge addition to the field of FPGAs (Field Programmable Gate Array), designed to deliver high performance, flexibility, and efficiency for complex digital circuits. This FPGA is engineered to cater to a wide range of applications requiring high-speed data processing and significant logic capacity. Its integration into the 1152FCBGA package ensures robust connectivity and compact design, making it ideal for advanced systems needing dense configurations and reduced footprint.
XC2VP30-7FFG1152C Features
- High I/O count: Incorporates 644 programmable I/Os which facilitate extensive interfacing with a multitude of external devices, enhancing system versatility.
- Dense package: The 1152FCBGA package provides a compact form factor, essential for modern high-density electronic applications.
- Advanced configuration capabilities: Allows for customizable logic blocks, enabling precise and efficient mapping of complex logic circuits.
XC2VP30-7FFG1152C Applications
- Telecommunications Equipment: Used in routing and switching systems to manage data flow efficiently across networks.
- Automotive Driver Assistance Systems: Integrates into automotive safety systems, helping to process sensor data for real-time decision making.
- Medical Imaging Devices: Essential for processing complex algorithms in medical diagnostics equipment, enhancing image clarity and resolution.
- Industrial Automation: Serves as the control center in automated machinery, coordinating tasks and increasing operational efficiency.
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