XC2VP30-7FFG1152C

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Mfr.Part #
XC2VP30-7FFG1152C
Manufacturer
AMD Xilinx
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 644 I/O 1152FCBGA
Stock
28,053
In Stock :
28,053

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
ECCN Code :
3A991.D
Peak Reflow Temperature (Cel) :
245
RAM Size :
306kB
Clock Frequency :
1350MHz
Number of LABs/CLBs :
3424
Number of Registers :
27392
Mounting Type :
Surface Mount
Number of Logic Elements/Cells :
30816
Terminal Position :
BOTTOM
Speed Grade :
7
Factory Lead Time :
6 Weeks
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Form :
Ball
Height Seated (Max) :
3.4mm
Pbfree Code :
yes
Supply Voltage :
1.5V
Qualification Status :
Not Qualified
Mount :
Surface Mount
Operating Temperature :
0°C~85°C TJ
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Outputs :
644
Power Supplies :
1.51.5/3.32/2.52.5V
Terminal Pitch :
1mm
Operating Supply Voltage :
1.5V
Total RAM Bits :
2506752
Packaging :
Tray
Number of I/O :
644
Length :
35mm
Published :
2011
Number of Pins :
1152
Voltage - Supply :
1.425V~1.575V
Reach Compliance Code :
not_compliant
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Base Part Number :
XC2VP30
HTS Code :
8542.39.00.01
Combinatorial Delay of a CLB-Max :
0.28 ns
Series :
Virtex®-II Pro
JESD-609 Code :
e1
Package / Case :
1152-BBGA, FCBGA
Terminal Finish :
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
RoHS Status :
ROHS3 Compliant
Width :
35mm
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-7FFG1152C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Number of Pins:1152, Base Part Number:XC2VP30, Package / Case:1152-BBGA, FCBGA, XC2VP30-7FFG1152C pinout, XC2VP30-7FFG1152C datasheet PDF, XC2VP30-7FFG1152C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-7FFG1152C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2VP30-7FFG1152C


FPGAs AMD Xilinx XC2VP30-7FFG1152C Overview

The AMD Xilinx XC2VP30-7FFG1152C represents a cutting-edge addition to the field of FPGAs (Field Programmable Gate Array), designed to deliver high performance, flexibility, and efficiency for complex digital circuits. This FPGA is engineered to cater to a wide range of applications requiring high-speed data processing and significant logic capacity. Its integration into the 1152FCBGA package ensures robust connectivity and compact design, making it ideal for advanced systems needing dense configurations and reduced footprint.

XC2VP30-7FFG1152C Features

  • High I/O count: Incorporates 644 programmable I/Os which facilitate extensive interfacing with a multitude of external devices, enhancing system versatility.
  • Dense package: The 1152FCBGA package provides a compact form factor, essential for modern high-density electronic applications.
  • Advanced configuration capabilities: Allows for customizable logic blocks, enabling precise and efficient mapping of complex logic circuits.

XC2VP30-7FFG1152C Applications

  • Telecommunications Equipment: Used in routing and switching systems to manage data flow efficiently across networks.
  • Automotive Driver Assistance Systems: Integrates into automotive safety systems, helping to process sensor data for real-time decision making.
  • Medical Imaging Devices: Essential for processing complex algorithms in medical diagnostics equipment, enhancing image clarity and resolution.
  • Industrial Automation: Serves as the control center in automated machinery, coordinating tasks and increasing operational efficiency.
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