XC2VP30-7FF1152C
- Mfr.Part #
- XC2VP30-7FF1152C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 644 I/O 1152FCBGA
- Stock
- 18,492
- In Stock :
- 18,492
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Voltage - Supply :
- 1.425V~1.575V
- Number of Logic Elements/Cells :
- 30816
- Speed Grade :
- 7
- RAM Size :
- 306kB
- Terminal Pitch :
- 1mm
- Number of Outputs :
- 644
- Time@Peak Reflow Temperature-Max (s) :
- 30
- RoHS Status :
- Non-RoHS Compliant
- Number of I/O :
- 644
- Length :
- 35mm
- Combinatorial Delay of a CLB-Max :
- 0.28 ns
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- HTS Code :
- 8542.39.00.01
- Factory Lead Time :
- 6 Weeks
- Package / Case :
- 1152-BBGA, FCBGA
- Number of Inputs :
- 644
- Peak Reflow Temperature (Cel) :
- 225
- Total RAM Bits :
- 2506752
- Height Seated (Max) :
- 3.4mm
- Pbfree Code :
- No
- Operating Temperature :
- 0°C~85°C TJ
- Published :
- 2009
- Mounting Type :
- Surface Mount
- Supply Voltage :
- 1.5V
- Operating Supply Voltage :
- 1.5V
- Clock Frequency :
- 1350MHz
- Number of Registers :
- 27392
- JESD-30 Code :
- S-PBGA-B1152
- Terminal Position :
- BOTTOM
- Width :
- 35mm
- Qualification Status :
- Not Qualified
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Power Supplies :
- 1.51.5/3.32/2.52.5V
- Packaging :
- Bulk
- ECCN Code :
- 3A991.D
- Terminal Form :
- Ball
- Surface Mount :
- yes
- Series :
- Virtex®-II Pro
- Number of LABs/CLBs :
- 3424
- JESD-609 Code :
- e0
- Datasheets
- XC2VP30-7FF1152C
FPGAs AMD Xilinx XC2VP30-7FF1152C Overview
Introducing the FPGas AMD Xilinx XC2VP30-7FF1152C, a high-performance field-programmable gate array that meets the complex and varied demands of modern digital circuits. Designed by industry leader AMD Xilinx, this FPGA is built for versatility with a robust 1152FCBGA package that offers a generous 644 I/O options, enabling expansive design flexibility. Ideal for advanced applications requiring high-speed data processing and multi-functional integration, this FPGA ensures reliability and performance at the core of your technology infrastructure.
XC2VP30-7FF1152C Features
The XC2VP30-7FF1152C FPGA is engineered for efficiency and adaptability. Key features include its substantial 1152-pin flip-chip ball grid array (FCBGA) packaging, which ensures optimal connectivity and thermal management. With its 644 I/O pins, it supports a wide range of peripherals and interfaces, making it a prime choice for developers looking to push the boundaries of what's possible within electronic design and applications.
XC2VP30-7FF1152C Applications
- Telecommunications Infrastructure: Utilized in routing and switching applications, this FPGA enhances the performance and scalability of network systems.
- Automotive Systems: Key to advanced driver assistance systems (ADAS), the XC2VP30-7FF1152C helps manage multiple inputs and outputs crucial for real-time decision making and vehicle control.
- Data Centers: Serves as the backbone for data processing units requiring high-speed data throughput and extensive data handling capabilities.
- Medical Devices: Integral to medical imaging systems, this FPGA processes complex algorithms quickly to deliver real-time images and diagnostics.
- Aerospace and Defense: Employs in avionics for both commercial and military applications, facilitating sophisticated onboard systems management and communication.
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