XC2VP30-7FF1152C

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Mfr.Part #
XC2VP30-7FF1152C
Manufacturer
AMD Xilinx
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 644 I/O 1152FCBGA
Stock
18,492
In Stock :
18,492

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Combinatorial Delay of a CLB-Max :
0.28 ns
Series :
Virtex®-II Pro
Number of Registers :
27392
Speed Grade :
7
HTS Code :
8542.39.00.01
Pbfree Code :
No
Terminal Pitch :
1mm
Length :
35mm
Time@Peak Reflow Temperature-Max (s) :
30
Voltage - Supply :
1.425V~1.575V
Packaging :
Bulk
Published :
2009
Terminal Form :
Ball
Clock Frequency :
1350MHz
Surface Mount :
yes
Terminal Position :
BOTTOM
Width :
35mm
Operating Temperature :
0°C~85°C TJ
JESD-609 Code :
e0
Mounting Type :
Surface Mount
Peak Reflow Temperature (Cel) :
225
Number of Logic Elements/Cells :
30816
Number of Inputs :
644
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RoHS Status :
Non-RoHS Compliant
ECCN Code :
3A991.D
Package / Case :
1152-BBGA, FCBGA
Operating Supply Voltage :
1.5V
Number of Outputs :
644
Total RAM Bits :
2506752
RAM Size :
306kB
Number of LABs/CLBs :
3424
Height Seated (Max) :
3.4mm
Supply Voltage :
1.5V
Factory Lead Time :
6 Weeks
Number of I/O :
644
Qualification Status :
Not Qualified
Power Supplies :
1.51.5/3.32/2.52.5V
JESD-30 Code :
S-PBGA-B1152
Datasheets
XC2VP30-7FF1152C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-7FF1152C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Package / Case:1152-BBGA, FCBGA, XC2VP30-7FF1152C pinout, XC2VP30-7FF1152C datasheet PDF, XC2VP30-7FF1152C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-7FF1152C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2VP30-7FF1152C


FPGAs AMD Xilinx XC2VP30-7FF1152C Overview

Introducing the FPGas AMD Xilinx XC2VP30-7FF1152C, a high-performance field-programmable gate array that meets the complex and varied demands of modern digital circuits. Designed by industry leader AMD Xilinx, this FPGA is built for versatility with a robust 1152FCBGA package that offers a generous 644 I/O options, enabling expansive design flexibility. Ideal for advanced applications requiring high-speed data processing and multi-functional integration, this FPGA ensures reliability and performance at the core of your technology infrastructure.

XC2VP30-7FF1152C Features

The XC2VP30-7FF1152C FPGA is engineered for efficiency and adaptability. Key features include its substantial 1152-pin flip-chip ball grid array (FCBGA) packaging, which ensures optimal connectivity and thermal management. With its 644 I/O pins, it supports a wide range of peripherals and interfaces, making it a prime choice for developers looking to push the boundaries of what's possible within electronic design and applications.

XC2VP30-7FF1152C Applications

  • Telecommunications Infrastructure: Utilized in routing and switching applications, this FPGA enhances the performance and scalability of network systems.
  • Automotive Systems: Key to advanced driver assistance systems (ADAS), the XC2VP30-7FF1152C helps manage multiple inputs and outputs crucial for real-time decision making and vehicle control.
  • Data Centers: Serves as the backbone for data processing units requiring high-speed data throughput and extensive data handling capabilities.
  • Medical Devices: Integral to medical imaging systems, this FPGA processes complex algorithms quickly to deliver real-time images and diagnostics.
  • Aerospace and Defense: Employs in avionics for both commercial and military applications, facilitating sophisticated onboard systems management and communication.
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