XC2VP30-6FGG676C

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Mfr.Part #
XC2VP30-6FGG676C
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 416 I/O 676FBGA
Stock
799
In Stock :
799

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Speed Grade :
6
Number of Logic Elements/Cells :
30816
Packaging :
Tray
Terminal Pitch :
1mm
Number of Outputs :
416
Pbfree Code :
yes
HTS Code :
8542.39.00.01
Terminal Finish :
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Combinatorial Delay of a CLB-Max :
0.32 ns
Length :
27mm
Voltage - Supply :
1.425V~1.575V
Number of LABs/CLBs :
3424
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Published :
2008
Number of Registers :
27392
ECCN Code :
3A991.D
Supply Voltage :
1.5V
Terminal Position :
BOTTOM
Pin Count :
676
Width :
27mm
Height Seated (Max) :
2.44mm
Qualification Status :
Not Qualified
Time@Peak Reflow Temperature-Max (s) :
30
Operating Supply Voltage :
1.5V
Peak Reflow Temperature (Cel) :
250
Number of I/O :
416
Total RAM Bits :
2506752
Power Supplies :
1.51.5/3.32/2.52.5V
RAM Size :
306kB
Number of Pins :
676
Mount :
Surface Mount
Base Part Number :
XC2VP30
RoHS Status :
ROHS3 Compliant
Series :
Virtex®-II Pro
Mounting Type :
Surface Mount
Number of Terminations :
676
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Clock Frequency :
1200MHz
JESD-609 Code :
e1
Operating Temperature :
0°C~85°C TJ
Factory Lead Time :
6 Weeks
Package / Case :
676-BGA
Datasheets
XC2VP30-6FGG676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-6FGG676C from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:676, Base Part Number:XC2VP30, Mounting Type:Surface Mount, Number of Terminations:676, Operating Temperature:0°C~85°C TJ, Package / Case:676-BGA, XC2VP30-6FGG676C pinout, XC2VP30-6FGG676C datasheet PDF, XC2VP30-6FGG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-6FGG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2VP30-6FGG676C


FPGAs AMD Xilinx XC2VP30-6FGG676C Overview

The FPGAs AMD Xilinx XC2VP30-6FGG676C is a highly versatile and powerful field-programmable gate array designed for applications that require high-performance digital processing and flexible hardware configuration. This FPGA is part of the Virtex-2 Pro family, renowned for its robust architecture and enhanced functionality that meet the complex needs of modern technology systems. With 416 I/O options packed into a 676-pin fine pitch ball grid array (FBGA), this product offers an exceptional level of integration and flexibility, making it an ideal solution for developers looking to push the boundaries of digital circuit design.

XC2VP30-6FGG676C Features

The XC2VP30-6FGG676C FPGA from AMD Xilinx is equipped with multiple features that make it stand out in the industry. It supports a variety of logic applications with its ample I/O ports and robust configuration options. Its 676FBGA packaging ensures a compact form factor while maintaining high-level performance and connectivity. The device's programmable logic provides a customizable platform for integrating various digital and analog functionalities, which is essential for scaling complex designs and responding quickly to market changes and technological advancements.

XC2VP30-6FGG676C Applications

  • Telecommunications: Used in communication infrastructure to manage signal processing and data flow efficiently, adapting to the needs of high-speed network environments.
  • Automotive Systems: Integral in advanced driver-assistance systems (ADAS) for processing and decision-making in real-time vehicle monitoring and control.
  • Consumer Electronics: Key component in high-performance consumer electronics such as gaming consoles and high-definition video devices, providing the necessary processing power and flexibility.
  • Industrial Automation: Empowers complex machinery control and automation systems, enhancing operational efficiency and reliability in demanding industrial settings.
  • Medical Devices: Supports the development of sophisticated medical imaging and diagnostic equipment, ensuring rapid processing capabilities and adaptability to new medical technologies.
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