XC2VP30-6FG676C
- Mfr.Part #
- XC2VP30-6FG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 416 I/O 676FCBGA
- Stock
- 69
- In Stock :
- 69
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Published :
- 2011
- Pin Count :
- 676
- RAM Size :
- 306kB
- Pbfree Code :
- No
- ECCN Code :
- 3A991.D
- Speed Grade :
- 6
- Number of I/O :
- 416
- Operating Supply Voltage :
- 1.5V
- Number of Terminations :
- 676
- Total RAM Bits :
- 2506752
- Terminal Position :
- BOTTOM
- Packaging :
- Bulk
- Operating Temperature :
- 0°C~85°C TJ
- RoHS Status :
- Non-RoHS Compliant
- Supply Voltage :
- 1.5V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- HTS Code :
- 8542.39.00.01
- Height Seated (Max) :
- 2.44mm
- Voltage - Supply :
- 1.425V~1.575V
- Moisture Sensitivity Level (MSL) :
- 2A (4 Weeks)
- Number of Registers :
- 27392
- Peak Reflow Temperature (Cel) :
- 225
- Length :
- 27mm
- Package / Case :
- 676-BBGA, FCBGA
- Terminal Form :
- Ball
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Reach Compliance Code :
- not_compliant
- Mounting Type :
- Surface Mount
- Surface Mount :
- yes
- Clock Frequency :
- 1200MHz
- Number of Outputs :
- 416
- Qualification Status :
- Not Qualified
- Number of Inputs :
- 416
- Terminal Pitch :
- 1mm
- JESD-609 Code :
- e0
- Series :
- Virtex®-II Pro
- Factory Lead Time :
- 6 Weeks
- Number of Logic Elements/Cells :
- 30816
- Number of LABs/CLBs :
- 3424
- Width :
- 27mm
- Combinatorial Delay of a CLB-Max :
- 0.32 ns
- Datasheets
- XC2VP30-6FG676C

FPGAs AMD Xilinx XC2VP30-6FG676C Overview
Introducing the advanced FPGAs AMD Xilinx XC2VP30-6FG676C, a highly versatile integrated circuit designed by AMD Xilinx, tailored for complex digital computations and high-speed interfacing. This FPGA (Field Programmable Gate Array) is engineered to support intricate, programmable logic operations, offering a formidable solution for designers and engineers requiring flexibility, performance, and scalability. The XC2VP30-6FG676C is encapsulated in a 676-pin flip-chip ball grid array (FCBGA) package, enabling robust physical connectivity and superior thermal management, crucial for maintaining integrity and performance under demanding conditions.
XC2VP30-6FG676C Features
The XC2VP30-6FG676C FPGA is equipped with 416 input/output ports, providing extensive interfacing capabilities. This high pin count facilitates multiple simultaneous connections and functions, making it ideal for complex digital environments. The device's architecture is designed for optimal configuration speed and efficiency, ensuring rapid deployment of applications and swift reconfiguration as project demands evolve.
XC2VP30-6FG676C Applications
- Telecommunications Infrastructure: Utilized in routers, switches, and other network equipment, the XC2VP30-6FG676C helps manage data flow efficiently, ensuring enhanced signal integrity and speed in high-demand telecommunications environments.
- Automotive Systems: Embedded in driver assistance systems, this FPGA processes multiple inputs from automotive sensors to provide real-time responses, crucial for safety and performance enhancements in modern vehicles.
- Consumer Electronics: Applied in devices like high-performance personal computers, gaming consoles, and home entertainment systems, the XC2VP30-6FG676C enhances processing capabilities, supporting richer multimedia experiences and higher data throughput.
- Industrial Automation: In control systems, this FPGA facilitates complex algorithm computations and process control, improving operational efficiencies and precision in automated manufacturing setups.
- Aerospace and Defense: Deployed in systems requiring robust, secure data processing capabilities, the XC2VP30-6FG676C supports critical applications in navigation, communication, and surveillance in the aerospace and defense sectors.
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