XC2VP30-6FFG896I

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Mfr.Part #
XC2VP30-6FFG896I
Manufacturer
AMD Xilinx
Package / Case
896-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 556 I/O 896FCBGA
Stock
4,679
In Stock :
4,679

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Length :
31mm
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of Registers :
27392
Power Supplies :
1.51.5/3.32/2.52.5V
Peak Reflow Temperature (Cel) :
245
Series :
Virtex®-II Pro
Factory Lead Time :
6 Weeks
Speed Grade :
6
Mounting Type :
Surface Mount
Total RAM Bits :
2506752
Operating Temperature :
-40°C~100°C TJ
Terminal Position :
BOTTOM
RoHS Status :
ROHS3 Compliant
Terminal Form :
Ball
Number of Terminations :
896
Height Seated (Max) :
3.4mm
Packaging :
Tray
Terminal Finish :
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Published :
2011
Pin Count :
896
Mount :
Surface Mount
Width :
31mm
Combinatorial Delay of a CLB-Max :
0.32 ns
HTS Code :
8542.39.00.01
Pbfree Code :
yes
Number of Pins :
896
Qualification Status :
Not Qualified
Reach Compliance Code :
not_compliant
Number of Outputs :
556
Terminal Pitch :
1mm
Base Part Number :
XC2VP30
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Package / Case :
896-BBGA, FCBGA
Clock Frequency :
1200MHz
Supply Voltage :
1.5V
Operating Supply Voltage :
1.5V
Voltage - Supply :
1.425V~1.575V
Number of I/O :
556
Time@Peak Reflow Temperature-Max (s) :
30
JESD-609 Code :
e1
Number of Logic Elements/Cells :
30816
ECCN Code :
3A991.D
Number of LABs/CLBs :
3424
RAM Size :
306kB
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-6FFG896I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Number of Terminations:896, Number of Pins:896, Base Part Number:XC2VP30, Package / Case:896-BBGA, FCBGA, XC2VP30-6FFG896I pinout, XC2VP30-6FFG896I datasheet PDF, XC2VP30-6FFG896I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-6FFG896I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2VP30-6FFG896I


FPGAs AMD Xilinx XC2VP30-6FFG896I Overview

The FPGAs AMD Xilinx XC2VP30-6FFG896I is a highly versatile integrated circuit designed by industry-leading AMD Xilinx for applications requiring high-speed, flexible logic operations and large I/O interfacing capabilities. This FPGA stands out for its robust 896FCBGA package, which ensures high reliability and superior performance in complex electronic environments. It is an excellent choice for designers aiming to accelerate their development cycles and enhance system performance, thanks to its programmable logic that adapts to multiple requirements and challenges. This FPGA is ideal for applications where customization and speed are critical, providing the necessary tools and features to drive innovation and efficiency in high-demand systems.

XC2VP30-6FFG896I Features

The XC2VP30-6FFG896I by AMD Xilinx includes several features that make it a powerful component for many technological solutions. Key features include an array of 556 I/O pins, which allows for extensive interfacing with other parts of the system. The device is housed in a 896-pin Flip-Chip Ball Grid Array (FCBGA) package, which provides robust support for dense circuit designs and enhances thermal management. Its high integration capabilities make it a reliable and efficient solution for complex designs requiring a variety of integrated functions and rapid data processing.

XC2VP30-6FFG896I Applications

  • Telecommunications Infrastructure: Used in networking hardware to manage data flow and signal processing, enhancing communication speed and reliability.
  • Automotive Driver Assistance Systems: Implements complex algorithms needed for real-time processing in systems like adaptive cruise control and collision avoidance, improving vehicle safety and performance.
  • Medical Imaging Devices: Facilitates high-speed processing of imaging data, crucial for devices such as MRI and ultrasound scanners, enhancing image clarity and diagnostic capabilities.
  • Industrial Automation: Controls machinery and processes with high precision and speed, crucial for improving efficiency and reducing operational downtime in manufacturing environments.
  • Consumer Electronics: Empowers high-performance consumer electronics, such as gaming consoles and smart TVs, with enhanced graphics and processing capabilities.
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