XC2VP30-6FFG896I

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Mfr.Part #
XC2VP30-6FFG896I
Manufacturer
AMD Xilinx
Package / Case
896-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 556 I/O 896FCBGA
Stock
4,679
In Stock :
4,679

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Published :
2011
Voltage - Supply :
1.425V~1.575V
Package / Case :
896-BBGA, FCBGA
Terminal Position :
BOTTOM
Power Supplies :
1.51.5/3.32/2.52.5V
Total RAM Bits :
2506752
Operating Temperature :
-40°C~100°C TJ
Height Seated (Max) :
3.4mm
Peak Reflow Temperature (Cel) :
245
Packaging :
Tray
Number of Logic Elements/Cells :
30816
Number of Registers :
27392
Length :
31mm
JESD-609 Code :
e1
Terminal Finish :
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Number of Terminations :
896
RoHS Status :
ROHS3 Compliant
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Pbfree Code :
yes
Terminal Form :
Ball
Qualification Status :
Not Qualified
Terminal Pitch :
1mm
ECCN Code :
3A991.D
Mount :
Surface Mount
RAM Size :
306kB
Number of I/O :
556
Mounting Type :
Surface Mount
Operating Supply Voltage :
1.5V
Combinatorial Delay of a CLB-Max :
0.32 ns
Pin Count :
896
Width :
31mm
Number of Outputs :
556
Reach Compliance Code :
not_compliant
HTS Code :
8542.39.00.01
Time@Peak Reflow Temperature-Max (s) :
30
Supply Voltage :
1.5V
Series :
Virtex®-II Pro
Speed Grade :
6
Factory Lead Time :
6 Weeks
Number of LABs/CLBs :
3424
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Base Part Number :
XC2VP30
Number of Pins :
896
Clock Frequency :
1200MHz
Datasheets
XC2VP30-6FFG896I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-6FFG896I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:896-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, Number of Terminations:896, Mounting Type:Surface Mount, Base Part Number:XC2VP30, Number of Pins:896, XC2VP30-6FFG896I pinout, XC2VP30-6FFG896I datasheet PDF, XC2VP30-6FFG896I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-6FFG896I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2VP30-6FFG896I


FPGAs AMD Xilinx XC2VP30-6FFG896I Overview

The FPGAs AMD Xilinx XC2VP30-6FFG896I is a highly versatile integrated circuit designed by industry-leading AMD Xilinx for applications requiring high-speed, flexible logic operations and large I/O interfacing capabilities. This FPGA stands out for its robust 896FCBGA package, which ensures high reliability and superior performance in complex electronic environments. It is an excellent choice for designers aiming to accelerate their development cycles and enhance system performance, thanks to its programmable logic that adapts to multiple requirements and challenges. This FPGA is ideal for applications where customization and speed are critical, providing the necessary tools and features to drive innovation and efficiency in high-demand systems.

XC2VP30-6FFG896I Features

The XC2VP30-6FFG896I by AMD Xilinx includes several features that make it a powerful component for many technological solutions. Key features include an array of 556 I/O pins, which allows for extensive interfacing with other parts of the system. The device is housed in a 896-pin Flip-Chip Ball Grid Array (FCBGA) package, which provides robust support for dense circuit designs and enhances thermal management. Its high integration capabilities make it a reliable and efficient solution for complex designs requiring a variety of integrated functions and rapid data processing.

XC2VP30-6FFG896I Applications

  • Telecommunications Infrastructure: Used in networking hardware to manage data flow and signal processing, enhancing communication speed and reliability.
  • Automotive Driver Assistance Systems: Implements complex algorithms needed for real-time processing in systems like adaptive cruise control and collision avoidance, improving vehicle safety and performance.
  • Medical Imaging Devices: Facilitates high-speed processing of imaging data, crucial for devices such as MRI and ultrasound scanners, enhancing image clarity and diagnostic capabilities.
  • Industrial Automation: Controls machinery and processes with high precision and speed, crucial for improving efficiency and reducing operational downtime in manufacturing environments.
  • Consumer Electronics: Empowers high-performance consumer electronics, such as gaming consoles and smart TVs, with enhanced graphics and processing capabilities.
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