XC2VP30-6FFG896C
- Mfr.Part #
- XC2VP30-6FFG896C
- Manufacturer
- AMD Xilinx
- Package / Case
- 896-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 556 I/O 896FCBGA
- Stock
- 10,043
- In Stock :
- 10,043
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Series :
- Virtex®-II Pro
- ECCN Code :
- 3A991.D
- Lead Free :
- Lead Free
- RoHS Status :
- ROHS3 Compliant
- Number of Pins :
- 896
- Number of Terminations :
- 896
- RAM Size :
- 306kB
- Voltage - Supply :
- 1.425V~1.575V
- Number of Outputs :
- 556
- Terminal Form :
- Ball
- Number of Logic Elements/Cells :
- 30816
- Package / Case :
- 896-BBGA, FCBGA
- Height Seated (Max) :
- 3.4mm
- Mounting Type :
- Surface Mount
- JESD-609 Code :
- e1
- Terminal Pitch :
- 1mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Factory Lead Time :
- 6 Weeks
- Pbfree Code :
- yes
- Number of I/O :
- 556
- Total RAM Bits :
- 2506752
- HTS Code :
- 8542.39.00.01
- Qualification Status :
- Not Qualified
- Speed Grade :
- 6
- Terminal Position :
- BOTTOM
- Operating Supply Voltage :
- 1.5V
- Base Part Number :
- XC2VP30
- Supply Voltage :
- 1.5V
- Power Supplies :
- 1.51.5/3.32/2.52.5V
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Peak Reflow Temperature (Cel) :
- 245
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Operating Temperature :
- 0°C~85°C TJ
- Pin Count :
- 896
- Width :
- 31mm
- Combinatorial Delay of a CLB-Max :
- 0.32 ns
- Packaging :
- Tray
- Clock Frequency :
- 1200MHz
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of LABs/CLBs :
- 3424
- Published :
- 2005
- Mount :
- Surface Mount
- Number of Registers :
- 27392
- Length :
- 31mm
- Datasheets
- XC2VP30-6FFG896C
FPGAs AMD Xilinx XC2VP30-6FFG896C Overview
The AMD Xilinx XC2VP30-6FFG896C FPGA is a high-performance, field-programmable gate array that offers a versatile solution for demanding applications across various industries. Designed to deliver exceptional processing speeds and a high degree of programmable logic flexibility, this FPGA is ideal for developers looking to push the boundaries of technological innovation. The XC2VP30-6FFG896C is built in a compact 896-pin flip-chip BGA (FCBGA) package, providing ample I/O resources with 556 pins available for multifaceted integrations and applications.
XC2VP30-6FFG896C Features
This particular model from AMD Xilinx features robust interfacing capabilities and is equipped with a rich set of features designed to enhance performance and simplify development. With its extensive I/O options and high-speed logic capabilities, the XC2VP30-6FFG896C is perfectly suited to handle complex digital computations and signal processing tasks that are essential in modern electronic devices.
XC2VP30-6FFG896C Applications
- Telecommunications: Utilized in communication infrastructure to manage signal processing tasks, enhancing bandwidth and reducing latency.
- Data Centers: Critical in managing data flow and processing operations, ensuring efficient handling of large volumes of information.
- Automotive Systems: Employed in advanced driver-assistance systems (ADAS) to process multiple inputs from sensors and cameras, enhancing vehicle safety and functionality.
- Consumer Electronics: Integral to the design of high-performance, multi-functional consumer gadgets, improving user experience and device capability.
- Industrial Automation: Used in control systems for automation processes, increasing precision and reliability in production lines.
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