XC2VP30-6FFG1152I
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- Mfr.Part #
- XC2VP30-6FFG1152I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 644 I/O 1152FCBGA
- Stock
- 20,717
- In Stock ：
- 20,717
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of I/O :
- 644
- Clock Frequency :
- 1200MHz
- Operating Supply Voltage :
- 1.5V
- Total RAM Bits :
- 2506752
- Supply Voltage :
- 1.5V
- Number of Logic Elements/Cells :
- 30816
- Published :
- 2011
- Width :
- 35mm
- RoHS Status :
- ROHS3 Compliant
- Number of Pins :
- 1152
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Packaging :
- Tray
- Base Part Number :
- XC2VP30
- Qualification Status :
- Not Qualified
- Terminal Position :
- BOTTOM
- Factory Lead Time :
- 6 Weeks
- Peak Reflow Temperature (Cel) :
- 245
- Speed Grade :
- 6
- Package / Case :
- 1152-BBGA, FCBGA
- Length :
- 35mm
- Operating Temperature :
- -40°C~100°C TJ
- Reach Compliance Code :
- not_compliant
- Terminal Form :
- Ball
- Pbfree Code :
- yes
- Height Seated (Max) :
- 3.4mm
- HTS Code :
- 8542.39.00.01
- Number of Outputs :
- 644
- Number of Registers :
- 27392
- RAM Size :
- 306kB
- ECCN Code :
- 3A991.D
- Power Supplies :
- 1.51.5/3.32/2.52.5V
- JESD-609 Code :
- e1
- Voltage - Supply :
- 1.425V~1.575V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Pitch :
- 1mm
- Combinatorial Delay of a CLB-Max :
- 0.32 ns
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of LABs/CLBs :
- 3424
- Series :
- Virtex®-II Pro
- Mounting Type :
- Surface Mount
- Mount :
- Surface Mount
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Datasheets
- XC2VP30-6FFG1152I
XC2VP30-6FFG1152I Documents
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FPGAs AMD Xilinx XC2VP30-6FFG1152I Overview
The FPGAs AMD Xilinx XC2VP30-6FFG1152I represents a state-of-the-art integrated circuit designed for applications requiring high-performance, flexibility, and reliability in data processing and signal management. This FPGA is housed in a 1152-pin flip-chip ball grid array (FCBGA) package, ensuring robust connectivity and excellent heat dissipation. With 644 programmable I/O ports, this product offers unmatched versatility for a wide range of industrial, commercial, and communication applications. The XC2VP30-6FFG1152I is engineered to deliver optimal performance in complex digital environments, making it an ideal choice for developers looking to leverage FPGA technology for system integration and innovation.
XC2VP30-6FFG1152I Features
The XC2VP30-6FFG1152I by AMD Xilinx is equipped with robust features designed to enhance system performance and flexibility. Key features include advanced logic cells for complex digital computations, high-speed DSP slices for efficient signal processing, and multiple clock management tiles providing improved timing accuracy. Additionally, its high interconnectivity allows for extensive configurability and scalability, meeting the needs of advanced digital systems.
XC2VP30-6FFG1152I Applications
- Telecommunications Equipment: The high I/O count and robust signal processing capabilities make the XC2VP30-6FFG1152I ideal for use in routers, switches, and base stations, enhancing data flow and network reliability.
- Automotive Systems: Utilized in advanced driver-assistance systems (ADAS) to process multiple inputs simultaneously, ensuring real-time responses critical in automotive safety applications.
- Medical Imaging Devices: Supports complex algorithms needed for real-time imaging processes in devices such as MRI and ultrasound scanners, contributing to sharper images and faster processing times.
- Data Centers: Integral in managing data throughput and security in servers and storage units, providing the scalability required for high-performance computing and large data management.
- Aerospace and Defense Systems: Offers the reliability and programmability needed for navigation systems, avionics, and surveillance systems, where performance and precision are mandatory.
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