XC2VP30-6FFG1152I
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- Mfr.Part #
- XC2VP30-6FFG1152I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 644 I/O 1152FCBGA
- Stock
- 20,717
- In Stock ：
- 20,717
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Pitch :
- 1mm
- Speed Grade :
- 6
- Number of Registers :
- 27392
- Terminal Position :
- BOTTOM
- Packaging :
- Tray
- Base Part Number :
- XC2VP30
- Operating Temperature :
- -40°C~100°C TJ
- ECCN Code :
- 3A991.D
- Length :
- 35mm
- Supply Voltage :
- 1.5V
- JESD-609 Code :
- e1
- Combinatorial Delay of a CLB-Max :
- 0.32 ns
- Series :
- Virtex®-II Pro
- Number of Pins :
- 1152
- RAM Size :
- 306kB
- Mount :
- Surface Mount
- HTS Code :
- 8542.39.00.01
- Operating Supply Voltage :
- 1.5V
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mounting Type :
- Surface Mount
- Package / Case :
- 1152-BBGA, FCBGA
- Number of I/O :
- 644
- Number of Outputs :
- 644
- Width :
- 35mm
- Number of Logic Elements/Cells :
- 30816
- Pbfree Code :
- yes
- Peak Reflow Temperature (Cel) :
- 245
- Reach Compliance Code :
- not_compliant
- Power Supplies :
- 1.51.5/3.32/2.52.5V
- Factory Lead Time :
- 6 Weeks
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of LABs/CLBs :
- 3424
- Clock Frequency :
- 1200MHz
- Voltage - Supply :
- 1.425V~1.575V
- Published :
- 2011
- Total RAM Bits :
- 2506752
- RoHS Status :
- ROHS3 Compliant
- Height Seated (Max) :
- 3.4mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Datasheets
- XC2VP30-6FFG1152I
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FPGAs AMD Xilinx XC2VP30-6FFG1152I Overview
The FPGAs AMD Xilinx XC2VP30-6FFG1152I represents a state-of-the-art integrated circuit designed for applications requiring high-performance, flexibility, and reliability in data processing and signal management. This FPGA is housed in a 1152-pin flip-chip ball grid array (FCBGA) package, ensuring robust connectivity and excellent heat dissipation. With 644 programmable I/O ports, this product offers unmatched versatility for a wide range of industrial, commercial, and communication applications. The XC2VP30-6FFG1152I is engineered to deliver optimal performance in complex digital environments, making it an ideal choice for developers looking to leverage FPGA technology for system integration and innovation.
XC2VP30-6FFG1152I Features
The XC2VP30-6FFG1152I by AMD Xilinx is equipped with robust features designed to enhance system performance and flexibility. Key features include advanced logic cells for complex digital computations, high-speed DSP slices for efficient signal processing, and multiple clock management tiles providing improved timing accuracy. Additionally, its high interconnectivity allows for extensive configurability and scalability, meeting the needs of advanced digital systems.
XC2VP30-6FFG1152I Applications
- Telecommunications Equipment: The high I/O count and robust signal processing capabilities make the XC2VP30-6FFG1152I ideal for use in routers, switches, and base stations, enhancing data flow and network reliability.
- Automotive Systems: Utilized in advanced driver-assistance systems (ADAS) to process multiple inputs simultaneously, ensuring real-time responses critical in automotive safety applications.
- Medical Imaging Devices: Supports complex algorithms needed for real-time imaging processes in devices such as MRI and ultrasound scanners, contributing to sharper images and faster processing times.
- Data Centers: Integral in managing data throughput and security in servers and storage units, providing the scalability required for high-performance computing and large data management.
- Aerospace and Defense Systems: Offers the reliability and programmability needed for navigation systems, avionics, and surveillance systems, where performance and precision are mandatory.
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