XC2VP30-6FFG1152C
- Mfr.Part #
- XC2VP30-6FFG1152C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 644 I/O 1152FCBGA
- Stock
- 25,136
- In Stock :
- 25,136
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Factory Lead Time :
- 6 Weeks
- Total RAM Bits :
- 2506752
- Length :
- 35mm
- Base Part Number :
- XC2VP30
- Lead Free :
- Lead Free
- Number of Pins :
- 1152
- RAM Size :
- 306kB
- Operating Temperature :
- 0°C~85°C TJ
- HTS Code :
- 8542.39.00.01
- Height Seated (Max) :
- 3.4mm
- RoHS Status :
- ROHS3 Compliant
- Mount :
- Surface Mount
- Published :
- 2005
- Operating Supply Voltage :
- 1.5V
- Voltage - Supply :
- 1.425V~1.575V
- ECCN Code :
- 3A991.D
- Number of Logic Elements/Cells :
- 30816
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Terminal Form :
- Ball
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Supply Voltage :
- 1.5V
- Terminal Pitch :
- 1mm
- Mounting Type :
- Surface Mount
- Clock Frequency :
- 1200MHz
- Combinatorial Delay of a CLB-Max :
- 0.32 ns
- Number of LABs/CLBs :
- 3424
- Width :
- 35mm
- Packaging :
- Tray
- Number of I/O :
- 644
- Power Supplies :
- 1.51.5/3.32/2.52.5V
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Pbfree Code :
- yes
- Series :
- Virtex®-II Pro
- JESD-609 Code :
- e1
- Package / Case :
- 1152-BBGA, FCBGA
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Registers :
- 27392
- Terminal Position :
- BOTTOM
- Speed Grade :
- 6
- Qualification Status :
- Not Qualified
- Peak Reflow Temperature (Cel) :
- 245
- Number of Outputs :
- 644
- Reach Compliance Code :
- not_compliant
- Datasheets
- XC2VP30-6FFG1152C
FPGAs AMD Xilinx XC2VP30-6FFG1152C Overview
The FPGAs AMD Xilinx XC2VP30-6FFG1152C is a highly advanced integrated circuit designed for applications that require superior processing power and flexibility. This IC from AMD Xilinx is built on a robust platform that allows for high-speed digital computations and versatile configuration options. It is encased in a 1152-pin FCBGA (Flip-Chip Ball Grid Array) package, ensuring a reliable connection and excellent heat dissipation. The XC2VP30-6FFG1152C offers a comprehensive solution for developers looking to leverage the dynamic capabilities of FPGA technology with a focus on efficiency and high performance.
XC2VP30-6FFG1152C Features
The XC2VP30-6FFG1152C FPGA includes 644 programmable I/O pins, which provide extensive interface options and flexibility in system design. This model supports advanced digital signal processing, making it ideal for complex algorithms and computation-intensive applications. Its high integration capabilities allow for reduced system complexity and enhanced reliability, making it a prime choice for designers aiming for a compact, yet powerful system architecture.
XC2VP30-6FFG1152C Applications
- Data Centers: Utilized in server infrastructure to manage and accelerate data processing and storage solutions, improving overall efficiency and performance.
- Telecommunications: Employed in communication infrastructure to enhance signal processing capabilities and support high-speed data transmission and switching.
- Automotive: Integral in advanced driver-assistance systems (ADAS) for processing complex algorithms related to sensor data interpretation and real-time decision making.
- Aerospace: Used in avionics for flight control systems, navigational aids, and onboard data handling systems that require high levels of data throughput and computational power.
- Consumer Electronics: Applied in high-performance gaming consoles and virtual reality systems to handle intense graphic processing and user interface management.
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