XC2VP30-6FF896I

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Mfr.Part #
XC2VP30-6FF896I
Manufacturer
AMD Xilinx
Package / Case
896-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 556 I/O 896FCBGA
Stock
227
In Stock :
227

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Peak Reflow Temperature (Cel) :
225
Operating Temperature :
-40°C~100°C TJ
Height Seated (Max) :
3.4mm
Number of LABs/CLBs :
3424
Time@Peak Reflow Temperature-Max (s) :
30
Speed Grade :
6
RAM Size :
306kB
Terminal Position :
BOTTOM
Combinatorial Delay of a CLB-Max :
0.32 ns
Length :
31mm
ECCN Code :
3A991.D
Number of Terminations :
896
Qualification Status :
Not Qualified
Power Supplies :
1.51.5/3.32/2.52.5V
Total RAM Bits :
2506752
Number of Registers :
27392
Number of Logic Elements/Cells :
30816
Factory Lead Time :
6 Weeks
Width :
31mm
Pin Count :
896
Terminal Form :
Ball
Mount :
Surface Mount
Number of I/O :
556
JESD-609 Code :
e0
Packaging :
Tray
Mounting Type :
Surface Mount
Pbfree Code :
No
Published :
1999
HTS Code :
8542.39.00.01
Package / Case :
896-BBGA, FCBGA
Clock Frequency :
1200MHz
RoHS Status :
Non-RoHS Compliant
Number of Outputs :
556
Terminal Pitch :
1mm
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Supply Voltage :
1.5V
Number of Pins :
896
Base Part Number :
XC2VP30
Supply Voltage :
1.5V
Voltage - Supply :
1.425V~1.575V
Series :
Virtex®-II Pro
Datasheets
XC2VP30-6FF896I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-6FF896I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Number of Terminations:896, Mounting Type:Surface Mount, Package / Case:896-BBGA, FCBGA, Number of Pins:896, Base Part Number:XC2VP30, XC2VP30-6FF896I pinout, XC2VP30-6FF896I datasheet PDF, XC2VP30-6FF896I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-6FF896I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2VP30-6FF896I


FPGAs AMD Xilinx XC2VP30-6FF896I Overview

The FPGAs AMD Xilinx XC2VP30-6FF896I is a high-performance, field-programmable gate array engineered to meet the demanding requirements of high-throughput applications. As part of the robust Virtex-II Pro series from AMD Xilinx, this FPGA offers a blend of versatility and power, equipped with 556 I/O pins housed in an 896-pin flip-chip ball grid array (FCBGA) package. This makes it an ideal solution for designers looking for a programmable logic device that supports complex digital systems with a focus on space-saving and thermal efficiency.

XC2VP30-6FF896I Features

This FPGA model boasts a range of features designed for both efficiency and high performance. Key features include its large number of input/output options, enabling flexible and extensive connectivity. The integration into the 896FCBGA package allows for a compact footprint on the PCB while still offering the robust interfacing capability needed for complex designs. Additionally, its compatibility with multiple signaling standards ensures that it can be used across various digital communication applications.

XC2VP30-6FF896I Applications

  • Telecommunications Equipment: Utilizes its high I/O count for managing multiple data streams simultaneously, ideal for switches and router applications.
  • Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing input from multiple sensors for real-time decision making.
  • Industrial Automation: Adapts to complex control systems in manufacturing processes, improving precision and efficiency.
  • Consumer Electronics: Can be integrated into high-definition multimedia interfaces and advanced gaming systems to enhance performance and user experience.
  • Medical Devices: Critical in the processing and management of data in imaging systems like MRI and ultrasound, providing faster computational capabilities and enhancing image quality.
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