XC2VP30-5FGG676C
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- Mfr.Part #
- XC2VP30-5FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 416 I/O 676FBGA
- Stock
- 37,245
- In Stock ：
- 37,245
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Lead Free :
- Lead Free
- Operating Supply Voltage :
- 1.5V
- Series :
- Virtex®-II Pro
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- 676-BGA
- Terminal Position :
- BOTTOM
- JESD-609 Code :
- e1
- Operating Temperature :
- 0°C~85°C TJ
- Number of Registers :
- 27392
- RoHS Status :
- ROHS3 Compliant
- Packaging :
- Tray
- ECCN Code :
- 3A991.D
- Pbfree Code :
- yes
- Factory Lead Time :
- 6 Weeks
- Terminal Form :
- Ball
- Number of Pins :
- 676
- Mounting Type :
- Surface Mount
- Number of Logic Elements/Cells :
- 30816
- Combinatorial Delay of a CLB-Max :
- 0.36 ns
- Height Seated (Max) :
- 2.44mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Supply Voltage :
- 1.5V
- RAM Size :
- 306kB
- Peak Reflow Temperature (Cel) :
- 250
- Number of Outputs :
- 416
- Number of Terminations :
- 676
- Pin Count :
- 676
- Published :
- 2005
- Number of LABs/CLBs :
- 3424
- Voltage - Supply :
- 1.425V~1.575V
- Base Part Number :
- XC2VP30
- Total RAM Bits :
- 2506752
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Qualification Status :
- Not Qualified
- Length :
- 27mm
- Number of I/O :
- 416
- Terminal Pitch :
- 1mm
- Speed Grade :
- 5
- Width :
- 27mm
- Mount :
- Surface Mount
- Datasheets
- XC2VP30-5FGG676C
FPGAs AMD Xilinx XC2VP30-5FGG676C Overview
The FPGAs AMD Xilinx XC2VP30-5FGG676C is a high-performance, field programmable gate array (FPGA) designed for optimal flexibility and integration. This device features a robust 676-ball fine-pitch grid array (FBGA) package and provides an extensive array of interfaces with 416 I/O pins, making it exceptionally well-suited for complex digital computations and signal processing tasks. The versatility of this FPGA allows for rapid prototyping and customization to meet specific application requirements, making it a top choice for engineers and developers looking to push the boundaries of technology. The XC2VP30-5FGG676C, with its sophisticated design and manufacturing by industry leader AMD Xilinx, is the ideal solution for businesses needing high-speed, reliable, and scalable logic operations.
XC2VP30-5FGG676C Features
The XC2VP30-5FGG676C FPGA offers numerous features that make it a powerful component for various high-demand applications. These features include a large number of input/output pins for extensive connectivity, a high-density ball grid array package that ensures a compact footprint while allowing for efficient heat dissipation and reliable physical connections. Additionally, the FPGA's architecture is designed to support complex digital processing tasks, which can be easily reconfigured for different functionalities as project requirements evolve.
XC2VP30-5FGG676C Applications
- Data Centers: Utilized for accelerating high-performance computing tasks, the XC2VP30-5FGG676C can manage intensive algorithms and data sorting, significantly boosting processing capabilities and efficiency in server environments.
- Telecommunications: This FPGA serves as a core component in infrastructure for handling complex signal processing tasks essential for modern telecommunication networks, enhancing data throughput and reliability.
- Automotive Technology: Applied in driver assistance systems, the XC2VP30-5FGG676C processes inputs from multiple sensors rapidly, facilitating real-time decision making and system responsiveness.
- Industrial Automation: In automation and control systems, this FPGA is pivotal in managing and coordinating machine operations, increasing productivity and safety in manufacturing processes.
- Consumer Electronics: The XC2VP30-5FGG676C is used in high-end consumer electronics to enable sophisticated features such as voice recognition and real-time video processing, enhancing user experiences.
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