XC2VP30-5FFG896C

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Mfr.Part #
XC2VP30-5FFG896C
Manufacturer
AMD Xilinx
Package / Case
896-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 556 I/O 896FCBGA
Stock
412
In Stock :
412

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
2506752
Length :
31mm
Peak Reflow Temperature (Cel) :
245
Package / Case :
896-BBGA, FCBGA
RoHS Status :
ROHS3 Compliant
Published :
2011
Reach Compliance Code :
not_compliant
JESD-609 Code :
e1
Terminal Pitch :
1mm
Speed Grade :
5
Factory Lead Time :
6 Weeks
ECCN Code :
3A991.D
Pbfree Code :
yes
Series :
Virtex®-II Pro
Terminal Position :
BOTTOM
Number of Logic Elements/Cells :
30816
Base Part Number :
XC2VP30
Operating Supply Voltage :
1.5V
Packaging :
Tray
Mount :
Surface Mount
Pin Count :
896
Width :
31mm
Number of Outputs :
556
Height Seated (Max) :
3.4mm
Number of Terminations :
896
RAM Size :
306kB
Voltage - Supply :
1.425V~1.575V
Number of LABs/CLBs :
3424
Combinatorial Delay of a CLB-Max :
0.36 ns
Supply Voltage :
1.5V
Number of Pins :
896
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of I/O :
556
Qualification Status :
Not Qualified
Operating Temperature :
0°C~85°C TJ
Terminal Form :
Ball
Time@Peak Reflow Temperature-Max (s) :
30
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of Registers :
27392
Mounting Type :
Surface Mount
Datasheets
XC2VP30-5FFG896C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-5FFG896C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:896-BBGA, FCBGA, Base Part Number:XC2VP30, Number of Terminations:896, Number of Pins:896, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, XC2VP30-5FFG896C pinout, XC2VP30-5FFG896C datasheet PDF, XC2VP30-5FFG896C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-5FFG896C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2VP30-5FFG896C


FPGAs AMD Xilinx XC2VP30-5FFG896C Overview

The FPGAs AMD Xilinx XC2VP30-5FFG896C represents a powerful Field Programmable Gate Array (FPGA) solution designed by AMD Xilinx, targeting demanding applications that require high-speed digital processing and versatile I/O capabilities. This component is housed in an 896-pin Flip-Chip Ball Grid Array (FCBGA) package, offering a robust platform for sophisticated circuit designs. With its ability to reprogram the logic to suit specific needs, this FPGA is a go-to choice for developers looking to customize their hardware for optimal performance and efficiency.

XC2VP30-5FFG896C Features

This FPGA is equipped with 556 user I/O pins, enabling extensive connectivity and interface options. The XC2VP30-5FFG896C is designed to meet the needs of highly specialized applications requiring multi-functional integration and high data throughput. Its architecture allows for dynamic reconfiguration, providing a flexible and adaptable hardware platform that can evolve with changing technological demands.

XC2VP30-5FFG896C Applications

  • Telecommunications: Deployed in infrastructure for communication networks, enhancing capabilities in signal processing and data flow management.
  • Industrial Automation: Utilized in control systems for real-time processing and monitoring, improving efficiency and reliability in automated tasks.
  • Aerospace and Defense: Applied in avionics and military hardware for robust, secure, and adaptable computing solutions necessary in critical environments.
  • Medical Imaging: Integral to the development of advanced imaging technologies, facilitating faster and more accurate diagnostic systems.
  • Automotive: Enhances automotive systems by supporting advanced driver-assistance systems (ADAS) and other critical vehicle functionalities.
This structured HTML content emphasizes the capabilities and potential applications of the XC2VP30-5FFG896C FPGA from AMD Xilinx, aligning with specific industry requirements to attract B2B customers.
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