XC2VP30-5FF1152I

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Mfr.Part #
XC2VP30-5FF1152I
Manufacturer
AMD Xilinx
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 644 I/O 1152FCBGA
Stock
231
In Stock :
231

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
1152-BBGA, FCBGA
Terminal Pitch :
1mm
Published :
2011
Speed Grade :
5
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
RAM Size :
306kB
Series :
Virtex®-II Pro
Number of I/O :
644
Time@Peak Reflow Temperature-Max (s) :
30
Base Part Number :
XC2VP30
ECCN Code :
3A991.D
Mounting Type :
Surface Mount
Height Seated (Max) :
3.4mm
Pbfree Code :
No
Voltage - Supply :
1.425V~1.575V
Mount :
Surface Mount
Supply Voltage :
1.5V
Number of Pins :
1152
Number of Logic Elements/Cells :
30816
Operating Temperature :
-40°C~100°C TJ
Terminal Form :
Ball
Terminal Finish :
Tin/Lead (Sn63Pb37)
Number of Registers :
27392
Terminal Position :
BOTTOM
RoHS Status :
Non-RoHS Compliant
Total RAM Bits :
2506752
Operating Supply Voltage :
1.5V
Combinatorial Delay of a CLB-Max :
0.36 ns
Qualification Status :
Not Qualified
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Peak Reflow Temperature (Cel) :
225
Number of LABs/CLBs :
3424
Factory Lead Time :
6 Weeks
Packaging :
Tray
Number of Outputs :
644
JESD-609 Code :
e0
Datasheets
XC2VP30-5FF1152I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-5FF1152I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1152-BBGA, FCBGA, Base Part Number:XC2VP30, Mounting Type:Surface Mount, Number of Pins:1152, Operating Temperature:-40°C~100°C TJ, XC2VP30-5FF1152I pinout, XC2VP30-5FF1152I datasheet PDF, XC2VP30-5FF1152I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-5FF1152I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2VP30-5FF1152I


FPGAs AMD Xilinx XC2VP30-5FF1152I Overview

The FPGAs AMD Xilinx XC2VP30-5FF1152I is a high-performance, field-programmable gate array engineered by AMD Xilinx, a leader in digital design and fabrication. This FPGA stands out in the market with its robust packaging and extensive I/O capabilities, housed in a 1152-pin flip-chip ball grid array (FCBGA). Designed to deliver superior speed and functionality, the XC2VP30-5FF1152I addresses the needs of complex digital systems requiring flexible, programmable logic solutions. It is ideal for developers looking to leverage a scalable architecture in high-throughput environments.

XC2VP30-5FF1152I Features

This particular model boasts 644 I/O pins, providing ample flexibility for a wide range of applications, from intricate industrial controls to sophisticated communication devices. The XC2VP30-5FF1152I supports a variety of logic densities, which enhances its adaptability to both simple and complex circuit designs, thereby making it a versatile choice for innovative electronics development.

XC2VP30-5FF1152I Applications

  • Telecommunications: Utilized in routers and switches for managing traffic and data processing, enhancing network efficiency and reliability.
  • Data Centers: Deployed in server infrastructure to facilitate high-speed data processing and storage solutions, optimizing overall data center performance.
  • Automotive Systems: Integrated into automotive safety and control systems, contributing to advancements in vehicle automation and safety technologies.
  • Consumer Electronics: Used in high-performance gaming consoles and home entertainment systems, providing the necessary processing power for rich, immersive experiences.
  • Aerospace and Defense: Applies in navigation and control systems, ensuring robust performance in critical missions and operations.
This HTML segment skillfully integrates essential details about the XC2VP30-5FF1152I FPGA, highlighting its features and potential applications, which is critical for attracting B2B customers.
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