XC2VP20-6FFG896C
- Mfr.Part #
- XC2VP20-6FFG896C
- Manufacturer
- AMD Xilinx
- Package / Case
- 896-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 556 I/O 896FCBGA
- Stock
- 48
- In Stock :
- 48
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Speed Grade :
- 6
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Height Seated (Max) :
- 3.4mm
- Series :
- Virtex®-II Pro
- Clock Frequency :
- 1200MHz
- Number of Outputs :
- 556
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells :
- 20880
- Operating Supply Voltage :
- 1.5V
- Qualification Status :
- Not Qualified
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage :
- 1.5V
- Number of Registers :
- 18560
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Position :
- BOTTOM
- Number of I/O :
- 556
- JESD-609 Code :
- e1
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Width :
- 31mm
- Mounting Type :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- 245
- RAM Size :
- 198kB
- ECCN Code :
- 3A991.D
- HTS Code :
- 8542.39.00.01
- Number of Terminations :
- 896
- Package / Case :
- 896-BBGA, FCBGA
- Base Part Number :
- XC2VP20
- Terminal Form :
- Ball
- Number of LABs/CLBs :
- 2320
- Number of Pins :
- 896
- Pbfree Code :
- yes
- Combinatorial Delay of a CLB-Max :
- 0.32 ns
- Length :
- 31mm
- Terminal Pitch :
- 1mm
- Packaging :
- Tray
- Power Supplies :
- 1.51.5/3.32/2.52.5V
- Mount :
- Surface Mount
- Total RAM Bits :
- 1622016
- Pin Count :
- 896
- Lead Free :
- Lead Free
- Factory Lead Time :
- 6 Weeks
- Operating Temperature :
- 0°C~85°C TJ
- Published :
- 2005
- Voltage - Supply :
- 1.425V~1.575V
- Datasheets
- XC2VP20-6FFG896C
FPGAs AMD Xilinx XC2VP20-6FFG896C Overview
The FPGAs AMD Xilinx XC2VP20-6FFG896C is a high-performance integrated circuit designed by AMD Xilinx, a leader in digital design innovation. This field-programmable gate array (FPGA) is optimized for advanced applications that require high-speed data processing and versatile configuration possibilities. It is encased in an 896-pin flip-chip ball grid array (FCBGA) package, which ensures robust physical protection and efficient connectivity. Ideal for demanding environments, this FPGA facilitates complex digital computations while maintaining flexibility and scalability across various applications.
XC2VP20-6FFG896C Features
The XC2VP20-6FFG896C boasts an impressive array of features suitable for high-performance tasks. With 556 input/output pins, this device offers extensive interfacing capabilities. The robust packaging of 896FCBGA not only secures the internal components but also provides optimal heat dissipation and reliable physical connections. This FPGA is engineered to support rapid prototyping and high-volume production runs, making it an indispensable tool for developers aiming to accelerate time-to-market for their innovative designs.
XC2VP20-6FFG896C Applications
- Telecommunications: Used in networking equipment such as routers and switches, the XC2VP20-6FFG896C manages data flow efficiently, enhancing broadband and wireless communication systems.
- Automotive Electronics: Essential for driver assistance systems, this FPGA processes multiple sensor inputs to provide real-time responses, crucial for safety and navigation enhancements.
- Industrial Automation: In automation systems, it controls machinery operations, integrating complex control algorithms to improve precision and productivity in manufacturing lines.
- Medical Devices: Applied in medical imaging systems, the XC2VP20-6FFG896C helps in processing complex visual data, enabling clearer and more precise diagnostic capabilities.
- Aerospace and Defense: Used in satellite and avionics systems, this FPGA withstands extreme environmental conditions, providing reliable performance for critical missions.
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