XC2VP2-6FFG672I
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- Mfr.Part #
- XC2VP2-6FFG672I
- Manufacturer
- AMD Xilinx
- Package / Case
- 672-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 204 I/O 672FCBGA
- Stock
- 6,506
- In Stock ：
- 6,506
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- JESD-609 Code :
- e1
- Number of Logic Elements/Cells :
- 3168
- Combinatorial Delay of a CLB-Max :
- 0.32 ns
- Operating Supply Voltage :
- 1.5V
- Terminal Pitch :
- 1mm
- Pin Count :
- 672
- RAM Size :
- 27kB
- RoHS Status :
- ROHS3 Compliant
- Total RAM Bits :
- 221184
- Clock Frequency :
- 1200MHz
- Number of Pins :
- 672
- Length :
- 27mm
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Speed Grade :
- 6
- Pbfree Code :
- yes
- Base Part Number :
- XC2VP2
- Reach Compliance Code :
- not_compliant
- Number of Outputs :
- 204
- Terminal Form :
- Ball
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Series :
- Virtex®-II Pro
- Packaging :
- Tray
- Qualification Status :
- Not Qualified
- Number of LABs/CLBs :
- 352
- Operating Temperature :
- -40°C~100°C TJ
- Package / Case :
- 672-BBGA, FCBGA
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Published :
- 2011
- Power Supplies :
- 1.51.5/3.32/2.52.5V
- ECCN Code :
- 3A991.D
- Number of Registers :
- 2816
- Mount :
- Surface Mount
- Supply Voltage :
- 1.5V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel) :
- 245
- HTS Code :
- 8542.39.00.01
- Voltage - Supply :
- 1.425V~1.575V
- Width :
- 27mm
- Number of I/O :
- 204
- Mounting Type :
- Surface Mount
- Number of Terminations :
- 672
- Number of CLBs :
- 352
- Factory Lead Time :
- 6 Weeks
- Datasheets
- XC2VP2-6FFG672I
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FPGAs AMD Xilinx XC2VP2-6FFG672I Overview
The FPGAs AMD Xilinx XC2VP2-6FFG672I is a highly capable integrated circuit specifically engineered for advanced system-level solutions. This product from AMD Xilinx stands out in the industry with its robust feature set tailored for high-performance applications requiring flexible programmability and high-speed digital processing. The XC2VP2-6FFG672I is designed in a compact 672-pin flip-chip ball grid array (FCBGA) package, which facilitates enhanced thermal management and reduced footprint on system boards. It supports a broad range of I/O standards and comes with an extensive array of configurable logic blocks, making it an ideal choice for designers looking to push the boundaries of hardware acceleration and digital signal processing.
XC2VP2-6FFG672I Features
This FPGA boasts a versatile 204 I/O interface, enabling extensive connectivity and compatibility with a wide array of electronic components and peripheral devices. Enhanced power management capabilities ensure that the XC2VP2-6FFG672I operates efficiently, even under strenuous conditions. With its robust configuration options, it provides developers with the flexibility needed to tailor their hardware solutions to specific application requirements, all while maintaining optimal performance and reliability.
XC2VP2-6FFG672I Applications
- Telecommunications: Utilized in networking hardware such as routers and switches for processing high-speed signals and managing data flow efficiently.
- Aerospace and Defense: Deployed in avionics for mission-critical applications, offering robust, programmable solutions that meet rigorous standards.
- Automotive: Integral in advanced driver-assistance systems (ADAS), where real-time signal processing is crucial for vehicle safety and functionality.
- Medical Devices: Used in medical imaging systems, where its high-speed processing capabilities facilitate faster and more accurate image rendering.
- Industrial: Applied in control systems for automation and robotic applications, enhancing operational efficiency and reliability.
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