XC2V8000-5FFG1517I

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Mfr.Part #
XC2V8000-5FFG1517I
Manufacturer
AMD Xilinx
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 1108 I/O 1517FCBGA
Stock
8,085
In Stock :
8,085

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Radiation Hardening :
No
Packaging :
Tray
JESD-609 Code :
e1
Mount :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Form :
Ball
Number of Gates :
8000000
Voltage - Supply :
1.425V~1.575V
Height Seated (Max) :
3.4mm
RoHS Status :
RoHS Compliant
ECCN Code :
EAR99
Pbfree Code :
yes
Supply Voltage :
1.5V
Operating Temperature :
-40°C~100°C TJ
Mounting Type :
Surface Mount
Total RAM Bits :
3096576
Combinatorial Delay of a CLB-Max :
0.39 ns
RAM Size :
378kB
Peak Reflow Temperature (Cel) :
245
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Position :
BOTTOM
Length :
40mm
Width :
40mm
Base Part Number :
XC2V8000
Number of Logic Cells :
104832
Number of I/O :
1108
Number of Registers :
93184
Series :
Virtex®-II
Number of Pins :
1517
Package / Case :
1517-BBGA, FCBGA
Terminal Pitch :
1mm
Speed Grade :
5
Number of LABs/CLBs :
11648
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Operating Supply Voltage :
1.5V
Published :
2007
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V8000-5FFG1517I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, Base Part Number:XC2V8000, Number of Pins:1517, Package / Case:1517-BBGA, FCBGA, XC2V8000-5FFG1517I pinout, XC2V8000-5FFG1517I datasheet PDF, XC2V8000-5FFG1517I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V8000-5FFG1517I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V8000-5FFG1517I


FPGAs AMD Xilinx XC2V8000-5FFG1517I Overview

The FPGAs AMD Xilinx XC2V8000-5FFG1517I is an advanced field-programmable gate array designed to meet the complex needs of modern digital circuits. With its substantial logic and I/O capabilities housed in a 1517-pin flip-chip ball grid array (FCBGA) package, this FPGA is ideal for high-speed, high-density applications that require flexibility and reliability. Engineered by AMD Xilinx, a leader in programmable logic solutions, the XC2V8000-5FFG1517I facilitates system-level integration while minimizing development time and costs, making it a top choice for designers looking to push the boundaries of technological innovation.

XC2V8000-5FFG1517I Features

This IC FPGA unit boasts 1108 I/O pins, providing ample interfacing capacity for complex, multi-peripheral systems. The high pin count is perfect for sophisticated communication protocols and multiple connectivity options, ensuring versatile deployment across a wide range of applications. The robust 1517FCBGA packaging not only protects the integrity of the chip but also aids in efficient heat dissipation, critical in maintaining operational stability under load.

XC2V8000-5FFG1517I Applications

  • Telecommunications: Utilized in routers and switches, the XC2V8000-5FFG1517I manages high-speed data processing and signal integrity, essential for maintaining robust network performance and reliability.
  • Data Centers: Serves as a core component in storage servers and network interface cards, where high I/O count and processing capabilities enable efficient data management and high throughput.
  • Automotive Electronics: Applied in advanced driver-assistance systems (ADAS), this FPGA handles sensor data integration and real-time decision-making, enhancing vehicle safety and performance.
  • Industrial Automation: In PLCs and control systems, it provides the necessary computation power and connectivity options to execute complex control algorithms and interface with various industrial sensors and actuaries.
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