XC2V8000-4FFG1517C

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Mfr.Part #
XC2V8000-4FFG1517C
Manufacturer
AMD Xilinx
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 1108 I/O 1517FCBGA
Stock
4,319
In Stock :
4,319

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Speed Grade :
4
Terminal Form :
Ball
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Pitch :
1mm
Number of LABs/CLBs :
11648
Mounting Type :
Surface Mount
JESD-609 Code :
e1
Terminal Position :
BOTTOM
Time@Peak Reflow Temperature-Max (s) :
30
Series :
Virtex®-II
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
ECCN Code :
EAR99
Clock Frequency :
650MHz
RAM Size :
378kB
Packaging :
Tray
Pbfree Code :
yes
RoHS Status :
RoHS Compliant
Peak Reflow Temperature (Cel) :
245
Published :
2007
Operating Supply Voltage :
1.5V
Radiation Hardening :
No
Total RAM Bits :
3096576
Base Part Number :
XC2V8000
Operating Temperature :
0°C~85°C TJ
Power Supplies :
1.51.5/3.33.3V
Number of Registers :
93184
Voltage - Supply :
1.425V~1.575V
Package / Case :
1517-BBGA, FCBGA
Supply Voltage :
1.5V
Number of Gates :
8000000
Number of I/O :
1108
Number of Pins :
1517
Mount :
Surface Mount
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V8000-4FFG1517C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:XC2V8000, Operating Temperature:0°C~85°C TJ, Package / Case:1517-BBGA, FCBGA, Number of Pins:1517, XC2V8000-4FFG1517C pinout, XC2V8000-4FFG1517C datasheet PDF, XC2V8000-4FFG1517C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V8000-4FFG1517C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V8000-4FFG1517C


FPGAs AMD Xilinx XC2V8000-4FFG1517C Overview

The FPGAs AMD Xilinx XC2V8000-4FFG1517C is a high-performance, field-programmable gate array designed to meet the demanding requirements of complex digital processing tasks. This product by AMD Xilinx boasts an advanced architecture that supports a wide range of applications, from high-speed communications to sophisticated real-time processing systems. It integrates 1108 I/O pins in a 1517 flip-chip ball grid array (FCBGA) package, enabling versatile connectivity and high-speed data transfer capabilities essential for modern electronic devices. Its robust configuration and adaptable functionality make it ideal for developers looking to push the boundaries of technological innovation.

XC2V8000-4FFG1517C Features

The XC2V8000-4FFG1517C FPGA is packed with features that enhance its utility and efficiency in complex projects. Key features include a large number of input/output options, high-density logic cells, and a programmable logic design that allows for on-the-fly adjustments and updates. Its compatibility with multiple signaling standards ensures that it can be integrated into diverse hardware environments, while its high-speed transceivers facilitate efficient data handling and processing.

XC2V8000-4FFG1517C Applications

  • Telecommunications: Utilized in infrastructure for mobile and fixed network devices, enhancing data flow and signal integrity across vast networks.
  • Data Centers: Employs high-speed data processing capabilities to manage and streamline large volumes of data, optimizing server performance and energy efficiency.
  • Automotive Systems: Integrated into driver assistance systems to process real-time data from vehicle sensors, improving safety and vehicle dynamics.
  • Industrial Automation: Used in control systems for real-time monitoring and automation of manufacturing processes, increasing precision and productivity.
  • Consumer Electronics: Applied in the development of complex consumer electronics, such as high-performance gaming consoles and smart home devices, offering enhanced user experiences through superior computational power and connectivity.
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