XC2V8000-4FFG1152C

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Mfr.Part #
XC2V8000-4FFG1152C
Manufacturer
AMD Xilinx
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 824 I/O 1152FCBGA
Stock
4,326
In Stock :
4,326

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
3096576
Package / Case :
1152-BBGA, FCBGA
Qualification Status :
Not Qualified
Packaging :
Tray
Published :
2014
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mounting Type :
Surface Mount
Voltage - Supply :
1.425V~1.575V
Terminal Pitch :
1mm
Number of I/O :
824
Series :
Virtex®-II
RoHS Status :
RoHS Compliant
RAM Size :
378kB
Terminal Position :
BOTTOM
ECCN Code :
3A001.A.7.A
Number of LABs/CLBs :
11648
Length :
35mm
Pbfree Code :
yes
Terminal Finish :
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Base Part Number :
XC2V8000
JESD-609 Code :
e1
Supply Voltage :
1.5V
Width :
35mm
Combinatorial Delay of a CLB-Max :
0.44 ns
Mount :
Surface Mount
Height Seated (Max) :
3.4mm
Peak Reflow Temperature (Cel) :
245
Clock Frequency :
650MHz
Terminal Form :
Ball
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
HTS Code :
8542.39.00.01
JESD-30 Code :
S-PBGA-B1152
Number of Gates :
8000000
Operating Temperature :
0°C~85°C TJ
Time@Peak Reflow Temperature-Max (s) :
30
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V8000-4FFG1152C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1152-BBGA, FCBGA, Mounting Type:Surface Mount, Base Part Number:XC2V8000, Operating Temperature:0°C~85°C TJ, XC2V8000-4FFG1152C pinout, XC2V8000-4FFG1152C datasheet PDF, XC2V8000-4FFG1152C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V8000-4FFG1152C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V8000-4FFG1152C


FPGAs AMD Xilinx XC2V8000-4FFG1152C Overview

The FPGAs AMD Xilinx XC2V8000-4FFG1152C is a highly sophisticated field programmable gate array (FPGA) designed by AMD Xilinx for demanding applications requiring high-speed data processing and flexible hardware customization. With its 1152-pin flip-chip ball grid array (FCBGA) packaging, this FPGA supports a vast array of logic operations and connectivity options, making it an optimal choice for developers looking to leverage advanced digital circuit designs. Its capacity to handle 824 I/O points makes it a powerhouse for interfacing with a wide range of peripheral devices, providing robust solutions for complex electronic systems.

XC2V8000-4FFG1152C Features

This FPGA from AMD Xilinx stands out due to its expansive I/O capabilities, robust packaging, and compatibility with high-speed signal processing requirements. The device's 824 I/Os ensure versatile connectivity with other components in large systems, while the 1152FCBGA package guarantees durability and high performance in physically demanding environments. These features make the XC2V8000-4FFG1152C a reliable and powerful component for sophisticated electronics designs.

XC2V8000-4FFG1152C Applications

  • Telecommunications: Used in routers and switches, the XC2V8000-4FFG1152C enhances signal integrity and speeds up data flow across networks.
  • Automotive: Integral in driver assistance systems, it processes multiple inputs from automotive sensors to provide real-time responses.
  • Data Centers: Helps in managing data throughput and security protocols in servers and storage devices.
  • Aerospace: Utilized in navigation and control systems, the FPGA ensures reliable operation under critical conditions.
  • Consumer Electronics: Supports complex user interfaces and multimedia processing in devices such as high-definition televisions and gaming consoles.
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