XC2V8000-4FF1517I

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Mfr.Part #
XC2V8000-4FF1517I
Manufacturer
AMD Xilinx
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 1108 I/O 1517FCBGA
Stock
39,949
In Stock :
39,949

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Finish :
Tin/Lead (Sn63Pb37)
Mount :
Surface Mount
Series :
Virtex®-II
Published :
2007
Radiation Hardening :
No
Terminal Form :
Ball
Terminal Pitch :
1mm
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Pbfree Code :
No
Operating Supply Voltage :
1.5V
Power Supplies :
1.51.5/3.33.3V
Packaging :
Tray
Mounting Type :
Surface Mount
Package / Case :
1517-BBGA, FCBGA
ECCN Code :
EAR99
Total RAM Bits :
3096576
Number of I/O :
1108
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Base Part Number :
XC2V8000
RoHS Status :
Non-RoHS Compliant
Voltage - Supply :
1.425V~1.575V
Supply Voltage :
1.5V
Number of Gates :
8000000
Number of LABs/CLBs :
11648
Time@Peak Reflow Temperature-Max (s) :
30
Number of Registers :
93184
Number of Pins :
1517
Terminal Position :
BOTTOM
RAM Size :
378kB
Peak Reflow Temperature (Cel) :
225
Operating Temperature :
-40°C~100°C TJ
Clock Frequency :
650MHz
JESD-609 Code :
e0
Speed Grade :
4
Datasheets
XC2V8000-4FF1517I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V8000-4FF1517I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:1517-BBGA, FCBGA, Base Part Number:XC2V8000, Number of Pins:1517, Operating Temperature:-40°C~100°C TJ, XC2V8000-4FF1517I pinout, XC2V8000-4FF1517I datasheet PDF, XC2V8000-4FF1517I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V8000-4FF1517I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V8000-4FF1517I


FPGAs AMD Xilinx XC2V8000-4FF1517I Overview

The FPGAs AMD Xilinx XC2V8000-4FF1517I is a state-of-the-art field-programmable gate array (FPGA) designed to meet the rigorous demands of modern digital circuits. Manufactured by AMD Xilinx, this high-performance IC excels in environments requiring high I/O bandwidth and large-scale integration. The XC2V8000-4FF1517I features a robust 1517-pin flip-chip ball grid array (FCBGA) package, providing excellent electrical conductivity and physical robustness, ideal for sophisticated and dense circuit designs. This component is perfect for developers looking to push the boundaries of hardware acceleration, signal processing, and complex algorithm implementations in various industrial applications.

XC2V8000-4FF1517I Features

The XC2V8000-4FF1517I is equipped with 1108 I/O ports, offering extensive connectivity options and flexibility for various design requirements. The high I/O count is particularly beneficial for applications involving multiple data streams and high-speed interfaces. The FPGA's architecture is designed to facilitate efficient logic synthesis and layout, reducing development time and improving performance scalability. Additionally, its compatibility with advanced digital signal processing makes it an excellent choice for high-throughput applications that require rapid data processing and real-time performance.

XC2V8000-4FF1517I Applications

  • Telecommunications: Utilized in network routers and switches to manage data flow efficiently and enhance signal integrity across complex network infrastructures.
  • Automotive: Employed in advanced driver-assistance systems (ADAS) to process real-time sensor data, facilitating critical safety functions like collision avoidance and traffic management.
  • Aerospace: Integral to satellite communication systems, where robust signal processing capabilities are essential for reliable data transmission and onboard system management.
  • Video Processing: Used in high-definition video editing and broadcasting equipment to handle high-resolution video streams and complex real-time editing tasks.
  • Industrial Automation: Powers complex industrial machinery control systems, enhancing operational efficiency and precision in high-volume manufacturing environments.
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