XC2V8000-4FF1152I

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Mfr.Part #
XC2V8000-4FF1152I
Manufacturer
AMD Xilinx
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 824 I/O 1152FCBGA
Stock
40,123
In Stock :
40,123

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Series :
Virtex®-II
RAM Size :
378kB
JESD-609 Code :
e0
Voltage - Supply :
1.425V~1.575V
Peak Reflow Temperature (Cel) :
225
Radiation Hardening :
No
RoHS Status :
Non-RoHS Compliant
Number of Gates :
8000000
Terminal Form :
Ball
Number of I/O :
824
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
3096576
Length :
35mm
Time@Peak Reflow Temperature-Max (s) :
30
Published :
2013
Number of LABs/CLBs :
11648
Clock Frequency :
650MHz
Terminal Pitch :
1mm
Speed Grade :
4
Width :
35mm
Operating Temperature :
-40°C~100°C TJ
Operating Supply Voltage :
1.5V
Supply Voltage :
1.5V
Packaging :
Tray
Mount :
Surface Mount
Number of Pins :
1152
Pbfree Code :
No
Number of Registers :
93184
Terminal Position :
BOTTOM
ECCN Code :
EAR99
Package / Case :
1152-BBGA, FCBGA
Mounting Type :
Surface Mount
Number of Outputs :
824
Terminal Finish :
Tin/Lead (Sn63Pb37)
Power Supplies :
1.51.5/3.33.3V
Base Part Number :
XC2V8000
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Datasheets
XC2V8000-4FF1152I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V8000-4FF1152I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Number of Pins:1152, Package / Case:1152-BBGA, FCBGA, Mounting Type:Surface Mount, Base Part Number:XC2V8000, XC2V8000-4FF1152I pinout, XC2V8000-4FF1152I datasheet PDF, XC2V8000-4FF1152I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V8000-4FF1152I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V8000-4FF1152I


FPGAs AMD Xilinx XC2V8000-4FF1152I Overview

The FPGAs AMD Xilinx XC2V8000-4FF1152I represents a pinnacle in field-programmable gate array design, offering unmatched flexibility and performance for complex digital processing tasks. Developed by AMD Xilinx, a leader in programmable logic solutions, this IC FPGA is housed in a 1152-pin flip-chip ball grid array (FCBGA) package, boasting a vast array of 824 I/O pins that provide substantial connectivity options. The XC2V8000-4FF1152I is engineered to meet the high demands of applications requiring rapid processing and high data throughput, making it an ideal choice for industries looking to harness the power of FPGA technology for advanced development and scaling.

XC2V8000-4FF1152I Features

This FPGA unit integrates several features that underscore its utility and advanced capabilities:

  • High I/O pin count (824 I/O) for extensive interfacing with other digital systems.
  • Advanced 1152-pin FCBGA packaging that ensures robust physical connectivity and thermal performance.
  • Designed for efficient power management and high-speed signal processing capabilities.
  • Compatible with AMD Xilinx's programming technology to facilitate easy integration and customization.

XC2V8000-4FF1152I Applications

  • Telecommunications: Utilized in networking hardware for data packet processing and signal integrity management, enhancing communication speeds and reliability.
  • Data Centers: Employs high-speed processing capabilities to manage data flow and operations, significantly increasing data center efficiency and throughput.
  • Aerospace and Defense: Serves critical roles in navigation systems, onboard processing, and communication systems, where reliability and performance are paramount.
  • Medical Imaging: Plays a vital part in the processing and analysis of complex imaging data, helping in the advancement of medical diagnostics technology.
  • Industrial Automation: Applied in control systems to enhance process automation, real-time decision making, and operational efficiency.
This HTML content is designed to provide a professional, clear, and optimized presentation of the XC2V8000-4FF1152I FPGA, suitable for B2B contexts aiming at bulk purchasing by illustrating its capabilities and potential applications comprehensively.
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