XC2V6000-6FFG1517C

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Mfr.Part #
XC2V6000-6FFG1517C
Manufacturer
AMD Xilinx
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 1104 I/O 1517FCBGA
Stock
36,668
In Stock :
36,668

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Min Operating Temperature :
0°C
Number of Pins :
1517
Number of Gates :
6000000
Series :
Virtex®-II
Number of I/O :
1104
Number of LABs/CLBs :
8448
RoHS Status :
RoHS Compliant
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Voltage - Supply :
1.425V~1.575V
Number of Registers :
67584
Speed Grade :
6
Published :
2007
Base Part Number :
XC2V6000
Max Operating Temperature :
85°C
Number of Logic Blocks (LABs) :
8448
Mounting Type :
Surface Mount
Radiation Hardening :
No
Mount :
Surface Mount
RAM Size :
324kB
Operating Supply Voltage :
1.5V
Operating Temperature :
0°C~85°C TJ
Supplier Device Package :
1517-FCBGA (40x40)
Total RAM Bits :
2654208
Package / Case :
1517-BBGA, FCBGA
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V6000-6FFG1517C from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:1517, Base Part Number:XC2V6000, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Package / Case:1517-BBGA, FCBGA, XC2V6000-6FFG1517C pinout, XC2V6000-6FFG1517C datasheet PDF, XC2V6000-6FFG1517C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V6000-6FFG1517C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V6000-6FFG1517C


FPGAs AMD Xilinx XC2V6000-6FFG1517C Overview

The FPGAs AMD Xilinx XC2V6000-6FFG1517C is a state-of-the-art integrated circuit designed for high-performance applications requiring extensive programmability and flexibility. Manufactured by industry leader AMD Xilinx, this FPGA is encapsulated in a 1517-pin FCBGA package, providing a robust platform for sophisticated digital and analog integration. The XC2V6000-6FFG1517C is engineered to meet the demands of advanced digital processing systems, where high I/O count, reliability, and adaptability are paramount. It supports a wide array of design implementations, particularly excelling in environments that require rapid prototyping and dynamic reconfiguration capabilities. This product is an excellent choice for businesses looking to leverage cutting-edge technology in competitive markets.

XC2V6000-6FFG1517C Features

This FPGA boasts 1104 programmable I/O pins, providing ample flexibility for comprehensive system designs. Its high pin count supports complex, multi-functional system integration without sacrificing performance. The device operates efficiently in a 1517-pin flip-chip ball grid array (FCBGA) package, ensuring optimal thermal management and space utilization in dense circuit designs. The XC2V6000-6FFG1517C also features robust support for multiple logic configurations, enhancing its utility in a variety of demanding applications.

XC2V6000-6FFG1517C Applications

  • Telecommunications Infrastructure: Utilizes its high I/O capacity and reprogrammability to handle complex signal processing tasks required in base stations and network switches.
  • Data Center Solutions: Employs its robust processing capabilities to manage data-intensive tasks such as load balancing and data sorting in servers and storage units.
  • Automotive Electronics: Supports advanced driver-assistance systems (ADAS) by enabling the integration of multiple sensors and actuators needed for real-time processing.
  • Aerospace and Defense: Critical for applications requiring high reliability and programmability, such as satellite communications systems and avionics.
  • Consumer Electronics: Drives innovation in high-end consumer electronics through support for intensive video processing and connectivity solutions in devices like smart TVs and gaming consoles.
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