XC2V6000-6FFG1517C
- Mfr.Part #
- XC2V6000-6FFG1517C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 1104 I/O 1517FCBGA
- Stock
- 36,668
- In Stock :
- 36,668
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Min Operating Temperature :
- 0°C
- Number of Pins :
- 1517
- Number of Gates :
- 6000000
- Series :
- Virtex®-II
- Number of I/O :
- 1104
- Number of LABs/CLBs :
- 8448
- RoHS Status :
- RoHS Compliant
- Packaging :
- Tray
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Voltage - Supply :
- 1.425V~1.575V
- Number of Registers :
- 67584
- Speed Grade :
- 6
- Published :
- 2007
- Base Part Number :
- XC2V6000
- Max Operating Temperature :
- 85°C
- Number of Logic Blocks (LABs) :
- 8448
- Mounting Type :
- Surface Mount
- Radiation Hardening :
- No
- Mount :
- Surface Mount
- RAM Size :
- 324kB
- Operating Supply Voltage :
- 1.5V
- Operating Temperature :
- 0°C~85°C TJ
- Supplier Device Package :
- 1517-FCBGA (40x40)
- Total RAM Bits :
- 2654208
- Package / Case :
- 1517-BBGA, FCBGA
- Datasheets
- XC2V6000-6FFG1517C

FPGAs AMD Xilinx XC2V6000-6FFG1517C Overview
The FPGAs AMD Xilinx XC2V6000-6FFG1517C is a state-of-the-art integrated circuit designed for high-performance applications requiring extensive programmability and flexibility. Manufactured by industry leader AMD Xilinx, this FPGA is encapsulated in a 1517-pin FCBGA package, providing a robust platform for sophisticated digital and analog integration. The XC2V6000-6FFG1517C is engineered to meet the demands of advanced digital processing systems, where high I/O count, reliability, and adaptability are paramount. It supports a wide array of design implementations, particularly excelling in environments that require rapid prototyping and dynamic reconfiguration capabilities. This product is an excellent choice for businesses looking to leverage cutting-edge technology in competitive markets.
XC2V6000-6FFG1517C Features
This FPGA boasts 1104 programmable I/O pins, providing ample flexibility for comprehensive system designs. Its high pin count supports complex, multi-functional system integration without sacrificing performance. The device operates efficiently in a 1517-pin flip-chip ball grid array (FCBGA) package, ensuring optimal thermal management and space utilization in dense circuit designs. The XC2V6000-6FFG1517C also features robust support for multiple logic configurations, enhancing its utility in a variety of demanding applications.
XC2V6000-6FFG1517C Applications
- Telecommunications Infrastructure: Utilizes its high I/O capacity and reprogrammability to handle complex signal processing tasks required in base stations and network switches.
- Data Center Solutions: Employs its robust processing capabilities to manage data-intensive tasks such as load balancing and data sorting in servers and storage units.
- Automotive Electronics: Supports advanced driver-assistance systems (ADAS) by enabling the integration of multiple sensors and actuators needed for real-time processing.
- Aerospace and Defense: Critical for applications requiring high reliability and programmability, such as satellite communications systems and avionics.
- Consumer Electronics: Drives innovation in high-end consumer electronics through support for intensive video processing and connectivity solutions in devices like smart TVs and gaming consoles.
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