XC2V6000-5FFG1152I

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Mfr.Part #
XC2V6000-5FFG1152I
Manufacturer
AMD Xilinx
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 824 I/O 1152FCBGA
Stock
48,648
In Stock :
48,648

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Published :
2007
Time@Peak Reflow Temperature-Max (s) :
30
Number of Registers :
67584
Height Seated (Max) :
3.4mm
Base Part Number :
XC2V6000
Number of Gates :
6000000
JESD-609 Code :
e1
Number of Outputs :
824
Terminal Pitch :
1mm
RoHS Status :
RoHS Compliant
Combinatorial Delay of a CLB-Max :
0.39 ns
Series :
Virtex®-II
Packaging :
Tray
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Cells :
76032
ECCN Code :
EAR99
Package / Case :
1152-BBGA, FCBGA
Voltage - Supply :
1.425V~1.575V
Supply Voltage :
1.5V
Number of LABs/CLBs :
8448
Terminal Position :
BOTTOM
Peak Reflow Temperature (Cel) :
245
Terminal Form :
Ball
Pbfree Code :
yes
Operating Supply Voltage :
1.5V
Mount :
Surface Mount
Total RAM Bits :
2654208
RAM Size :
324kB
Mounting Type :
Surface Mount
Speed Grade :
5
Operating Temperature :
-40°C~100°C TJ
Number of Pins :
1152
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Radiation Hardening :
No
Number of I/O :
824
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V6000-5FFG1152I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC2V6000, Package / Case:1152-BBGA, FCBGA, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Number of Pins:1152, XC2V6000-5FFG1152I pinout, XC2V6000-5FFG1152I datasheet PDF, XC2V6000-5FFG1152I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V6000-5FFG1152I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V6000-5FFG1152I


FPGAs AMD Xilinx XC2V6000-5FFG1152I Overview

The FPGAs AMD Xilinx XC2V6000-5FFG1152I is a high-performance field-programmable gate array designed for advanced integrated circuits applications. Manufactured by AMD Xilinx, this FPGA offers a versatile solution for developers looking to push the boundaries of hardware acceleration and system integration. Encased in a 1152-pin flip-chip ball grid array (FCBGA) package, it boasts 824 user I/Os, making it highly adaptable for complex digital systems. This component is ideal for customers needing robust, scalable solutions for high-throughput applications, underlining its capability to handle multiple inputs and outputs efficiently.

XC2V6000-5FFG1152I Features

The XC2V6000-5FFG1152I FPGA from AMD Xilinx comes equipped with an array of features that make it an excellent choice for a wide range of applications. It supports a high pin count which facilitates extensive connectivity options and versatility in system design. The FPGA architecture is optimized for reduced power consumption while maintaining high performance, ensuring reliability and efficiency in energy-sensitive projects.

XC2V6000-5FFG1152I Applications

  • Data Centers: Utilized in server farms to accelerate data processing and energy efficiency, enhancing overall performance and scalability.
  • Telecommunications: Deployed in telecom infrastructure to support high-speed data transmission and signal processing tasks.
  • Automotive Electronics: Integral in advanced driver-assistance systems (ADAS) for processing complex real-time data and supporting vehicle safety features.
  • Medical Imaging: Used in medical diagnostic equipment for processing complex imaging data, ensuring high-resolution outputs and real-time analysis.
  • Aerospace and Defense: Critical for applications in navigation systems and onboard data processing units in aircraft and defense equipment, ensuring reliability and robustness in harsh environments.
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