XC2V6000-4FFG1517C

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Mfr.Part #
XC2V6000-4FFG1517C
Manufacturer
AMD Xilinx
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 1104 I/O 1517FCBGA
Stock
37,134
In Stock :
37,134

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
1517-BBGA, FCBGA
Terminal Form :
Ball
Operating Temperature :
0°C~85°C TJ
RoHS Status :
RoHS Compliant
Peak Reflow Temperature (Cel) :
245
Voltage - Supply :
1.425V~1.575V
JESD-609 Code :
e1
Number of Logic Cells :
76032
Number of Pins :
1517
Terminal Position :
BOTTOM
Number of LABs/CLBs :
8448
RAM Size :
324kB
Terminal Pitch :
1mm
Time@Peak Reflow Temperature-Max (s) :
30
Mounting Type :
Surface Mount
Published :
2005
Number of Gates :
6000000
Operating Supply Voltage :
1.5V
Total RAM Bits :
2654208
Number of I/O :
1104
Base Part Number :
XC2V6000
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Clock Frequency :
650MHz
Series :
Virtex®-II
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Radiation Hardening :
No
Packaging :
Tray
Pbfree Code :
yes
Number of Registers :
67584
Power Supplies :
1.51.5/3.33.3V
Mount :
Surface Mount
Supply Voltage :
1.5V
ECCN Code :
EAR99
Speed Grade :
4
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V6000-4FFG1517C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1517-BBGA, FCBGA, Operating Temperature:0°C~85°C TJ, Number of Pins:1517, Mounting Type:Surface Mount, Base Part Number:XC2V6000, XC2V6000-4FFG1517C pinout, XC2V6000-4FFG1517C datasheet PDF, XC2V6000-4FFG1517C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V6000-4FFG1517C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V6000-4FFG1517C


FPGAs AMD Xilinx XC2V6000-4FFG1517C Overview

The FPGAs AMD Xilinx XC2V6000-4FFG1517C represents a pinnacle of technological advancement in the field of programmable logic devices. Designed by AMD Xilinx, this FPGA (Field Programmable Gate Array) is tailored for applications requiring high-speed digital processing and extensive I/O capabilities. The XC2V6000-4FFG1517C features a robust 1517-pin flip-chip BGA package that ensures reliable connectivity and superior performance in challenging environments. This FPGA is ideal for developers looking to push the boundaries of hardware acceleration, signal processing, and complex logic integration, making it a cornerstone in the development of cutting-edge electronic systems.

XC2V6000-4FFG1517C Features

The XC2V6000-4FFG1517C is equipped with 1104 user I/Os, allowing for versatile connectivity and integration options with other hardware components. Its high-capacity design is suitable for handling complex algorithms and multi-threaded applications efficiently. The device leverages advanced silicon technology from AMD Xilinx to deliver superior performance, enhanced thermal management, and reduced power consumption, which are crucial for sustainable, high-performance computing applications.

XC2V6000-4FFG1517C Applications

  • Telecommunications: Utilized in routers and switches for packet processing, the XC2V6000-4FFG1517C helps manage data flow efficiently across networks.
  • Automotive: Integral to advanced driver-assistance systems (ADAS), this FPGA processes inputs from vehicle sensors to enhance safety features.
  • Data Centers: Supports high-speed data processing tasks, crucial for cloud computing and massive data storage solutions.
  • Video Processing: Applied in video surveillance systems, the XC2V6000-4FFG1517C handles real-time video encoding and decoding, ensuring high-quality image capture and playback.
  • Industrial Automation: Enhances control systems in manufacturing processes, enabling precise machine operations and real-time decision making.
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