XC2V6000-4FF1152I

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Mfr.Part #
XC2V6000-4FF1152I
Manufacturer
AMD Xilinx
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 824 I/O 1152FCBGA
Stock
310
In Stock :
310

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Registers :
67584
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of Gates :
6000000
Voltage - Supply :
1.425V~1.575V
Min Operating Temperature :
-40°C
Number of I/O :
824
Number of Pins :
1152
Mounting Type :
Surface Mount
Speed Grade :
4
RAM Size :
324kB
Mount :
Surface Mount
Packaging :
Tray
Operating Supply Voltage :
1.5V
Supplier Device Package :
1152-CFCBGA (35x35)
Operating Temperature :
-40°C~100°C TJ
Radiation Hardening :
No
Published :
2007
Number of Logic Blocks (LABs) :
8448
RoHS Status :
Non-RoHS Compliant
Series :
Virtex®-II
Base Part Number :
XC2V6000
Number of LABs/CLBs :
8448
Max Operating Temperature :
100°C
Total RAM Bits :
2654208
Package / Case :
1152-BBGA, FCBGA
Datasheets
XC2V6000-4FF1152I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V6000-4FF1152I from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:1152, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Base Part Number:XC2V6000, Package / Case:1152-BBGA, FCBGA, XC2V6000-4FF1152I pinout, XC2V6000-4FF1152I datasheet PDF, XC2V6000-4FF1152I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V6000-4FF1152I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V6000-4FF1152I


FPGAs AMD Xilinx XC2V6000-4FF1152I Overview

The FPGAs AMD Xilinx XC2V6000-4FF1152I represents a powerful and versatile field programmable gate array (FPGA) designed to meet the high demands of modern digital processing. This integrated circuit, crafted by AMD Xilinx, one of the leaders in the semiconductor industry, boasts an impressive configuration of 824 input/output (I/O) ports and comes packaged in a robust 1152-pin flip-chip ball grid array (FCBGA). Its high I/O count and substantial logic resources make it ideal for complex, high-performance applications where flexibility and scalability are crucial. As businesses look to tackle more complex digital challenges, the XC2V6000-4FF1152I emerges as a critical tool in facilitating advanced digital designs and speeding up time-to-market for high-tech products.

XC2V6000-4FF1152I Features

The XC2V6000-4FF1152I FPGA is designed with several key features that make it a top choice for developers and engineers. Its extensive I/O capabilities, combined with a large-scale integration environment, allow for superior design flexibility. The device supports a wide range of digital and mixed-signal applications, thanks to its adaptable logic blocks and comprehensive embedded multipliers, which are essential for complex arithmetic functions. Additionally, the FPGA's support for multiple clock management techniques enhances system performance by optimizing data throughput and reducing latency.

XC2V6000-4FF1152I Applications

  • Data Centers: Utilized in managing vast amounts of data, ensuring efficient processing and quick data retrieval, this FPGA accelerates data processing tasks in servers and storage systems.
  • Telecommunications: Critical in the development of telecommunications equipment, the XC2V6000-4FF1152I enhances signal processing capabilities essential for base stations and network switches.
  • Automotive Systems: Deployed in advanced driver-assistance systems (ADAS), this FPGA helps in real-time image processing and sensor data analysis, crucial for autonomous driving technologies.
  • Medical Imaging: Applied in medical diagnostic equipment, it facilitates the processing of complex imaging algorithms required in ultrasound, MRI, and CT scanners.
  • Aerospace and Defense: Used in radar systems and avionics, the XC2V6000-4FF1152I supports the demanding computational needs and robust data processing required for aerospace applications.
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