XC2V4000-5FFG1152I

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Mfr.Part #
XC2V4000-5FFG1152I
Manufacturer
AMD Xilinx
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 824 I/O 1152FCBGA
Stock
16,879
In Stock :
16,879

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Peak Reflow Temperature (Cel) :
245
RAM Size :
270kB
Number of I/O :
824
Radiation Hardening :
No
Base Part Number :
XC2V4000
Mounting Type :
Surface Mount
ECCN Code :
EAR99
Voltage - Supply :
1.425V~1.575V
Terminal Form :
Ball
JESD-609 Code :
e1
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Supply Voltage :
1.5V
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Series :
Virtex®-II
Number of Registers :
46080
Number of Gates :
4000000
Pbfree Code :
yes
Terminal Pitch :
1mm
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Position :
BOTTOM
Number of Pins :
1152
Height Seated (Max) :
3.4mm
Packaging :
Tray
Number of Outputs :
824
Package / Case :
1152-BBGA, FCBGA
Speed Grade :
5
RoHS Status :
RoHS Compliant
Mount :
Surface Mount
Published :
2007
Combinatorial Delay of a CLB-Max :
0.39 ns
Total RAM Bits :
2211840
Operating Supply Voltage :
1.5V
Number of LABs/CLBs :
5760
Operating Temperature :
-40°C~100°C TJ
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V4000-5FFG1152I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC2V4000, Mounting Type:Surface Mount, Number of Pins:1152, Package / Case:1152-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, XC2V4000-5FFG1152I pinout, XC2V4000-5FFG1152I datasheet PDF, XC2V4000-5FFG1152I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V4000-5FFG1152I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V4000-5FFG1152I


FPGAs AMD Xilinx XC2V4000-5FFG1152I Overview

Introducing the advanced FPGAs AMD Xilinx XC2V4000-5FFG1152I, a high-performance, field-programmable gate array designed to meet the demanding needs of modern digital circuits. This robust FPGA features a versatile 1152-pin flip-chip ball grid array (FCBGA) package that ensures optimal electrical performance and heat dissipation, making it ideal for high-speed and high-density applications. With its substantial I/O capabilities encompassing 824 I/O pins, this device from AMD Xilinx is engineered to provide exceptional flexibility and scalability, enabling designers to create complex, integrated designs in sectors ranging from telecommunications to advanced scientific instruments.

XC2V4000-5FFG1152I Features

The XC2V4000-5FFG1152I FPGA is equipped with multiple features that enhance its efficiency and functionality. This includes extensive logic gates for complex operations, programmable IOs for tailored connectivity solutions, and a highly scalable architecture that supports both high-speed DSP applications and volatile memory solutions. Its robustness is further underscored by the industrial-grade construction, providing reliability in challenging environmental conditions.

XC2V4000-5FFG1152I Applications

  • Telecommunications: Utilized in base stations and networking equipment, where its high-speed I/O capabilities enable efficient data processing and improved bandwidth management.
  • Automotive Systems: Key in driving innovations in automotive electronics, particularly in advanced driver-assistance systems (ADAS) where fast and reliable processing is crucial.
  • Industrial Automation: Applied in control systems and robotics, helping to increase precision and reliability through advanced signal processing capabilities.
  • Consumer Electronics: Integral in the development of consumer electronics, such as high-performance gaming consoles and home automation systems, offering both enhanced performance and reduced power consumption.
  • Medical Devices: Critical for medical imaging and diagnostic equipment, supporting complex algorithms for real-time data analysis and visualization.
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