XC2V3000-6FGG676C
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- Mfr.Part #
- XC2V3000-6FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 484 I/O 676FBGA
- Stock
- 654
- In Stock ：
- 654
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mounting Type :
- Surface Mount
- Width :
- 27mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Clock Frequency :
- 820MHz
- Number of Registers :
- 28672
- Pin Count :
- 676
- JESD-609 Code :
- e1
- Operating Temperature :
- 0°C~85°C TJ
- Number of Pins :
- 676
- Mount :
- Surface Mount
- Published :
- 2007
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Gates :
- 3000000
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Peak Reflow Temperature (Cel) :
- 250
- Terminal Position :
- BOTTOM
- Number of Outputs :
- 484
- Terminal Pitch :
- 1mm
- Pbfree Code :
- yes
- RoHS Status :
- RoHS Compliant
- Total RAM Bits :
- 1769472
- Terminal Form :
- Ball
- Number of Terminations :
- 676
- Radiation Hardening :
- No
- Combinatorial Delay of a CLB-Max :
- 0.35 ns
- Package / Case :
- 676-BGA
- RAM Size :
- 216kB
- ECCN Code :
- 3A991.D
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of I/O :
- 484
- Speed Grade :
- 6
- Length :
- 27mm
- Number of LABs/CLBs :
- 3584
- Base Part Number :
- XC2V3000
- Voltage - Supply :
- 1.425V~1.575V
- Power Supplies :
- 1.51.5/3.33.3V
- Operating Supply Voltage :
- 1.5V
- Supply Voltage :
- 1.5V
- Series :
- Virtex®-II
- Packaging :
- Tray
- HTS Code :
- 8542.39.00.01
- Datasheets
- XC2V3000-6FGG676C
XC2V3000-6FGG676C Documents
FPGAs AMD Xilinx XC2V3000-6FGG676C Overview
The FPGAs AMD Xilinx XC2V3000-6FGG676C is a highly versatile and powerful field-programmable gate array (FPGA) designed to meet the demanding needs of modern digital circuits. Manufactured by AMD Xilinx, this IC FPGA integrates advanced technology to provide high-performance, flexibility, and the necessary tools for rapid deployment of complex logic circuits and system designs. It is packaged in a 676-pin fine-pitch ball grid array (FBGA), enabling robust physical integration in space-constrained environments while offering a substantial I/O count of 484. This product is ideal for developers looking for scalable solutions that require intensive processing capabilities and high-speed interfaces.
XC2V3000-6FGG676C Features
The XC2V3000-6FGG676C boasts several key features that make it an excellent choice for a wide range of applications. It offers ample logic resources, high-speed DSP processing, and GTP transceivers capable of supporting advanced serial communication protocols. Additionally, its programmable logic cells enable custom configuration for specific tasks, enhancing both performance and efficiency in complex system designs. The product's compatibility with leading-edge development tools from AMD Xilinx also ensures a streamlined design process from concept to implementation.
XC2V3000-6FGG676C Applications
- Telecommunications: Used in networking equipment to manage data flow and signal processing, enhancing bandwidth and reducing latency.
- Automotive: Integrated into driver assistance systems to process real-time sensor data and support safety-critical functions.
- Consumer Electronics: Empowers high-performance computing tasks in devices like gaming consoles and smart TVs for richer user experiences.
- Industrial: Applied in control systems for machinery and production lines, providing adaptability and precise control to optimize operations.
- Medical Devices: Utilized in imaging and diagnostic equipment to accelerate data processing capabilities and improve diagnostic accuracy.
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