XC2V3000-5FG676I
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- Mfr.Part #
- XC2V3000-5FG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 484 I/O 676FCBGA
- Stock
- 1
- In Stock ：
- 1
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Gates :
- 3000000
- Pbfree Code :
- No
- Terminal Position :
- BOTTOM
- Peak Reflow Temperature (Cel) :
- 225
- Series :
- Virtex®-II
- Height Seated (Max) :
- 2.6mm
- Number of LABs/CLBs :
- 3584
- Terminal Pitch :
- 1mm
- Pin Count :
- 676
- RAM Size :
- 216kB
- Mounting Type :
- Surface Mount
- Base Part Number :
- XC2V3000
- Packaging :
- Tray
- JESD-609 Code :
- e0
- Published :
- 2005
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Speed Grade :
- 5
- Package / Case :
- 676-BBGA, FCBGA
- Number of Outputs :
- 484
- Number of Registers :
- 28672
- Supply Voltage :
- 1.5V
- ECCN Code :
- 3A991.D
- Total RAM Bits :
- 1769472
- Width :
- 27mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Form :
- Ball
- Operating Temperature :
- -40°C~100°C TJ
- Voltage - Supply :
- 1.425V~1.575V
- Number of Terminations :
- 676
- Number of Pins :
- 676
- Mount :
- Surface Mount
- RoHS Status :
- Non-RoHS Compliant
- Length :
- 27mm
- Radiation Hardening :
- No
- Combinatorial Delay of a CLB-Max :
- 0.39 ns
- Number of I/O :
- 484
- Operating Supply Voltage :
- 1.5V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Datasheets
- XC2V3000-5FG676I
FPGAs AMD Xilinx XC2V3000-5FG676I Overview
The AMD Xilinx XC2V3000-5FG676I is a highly capable FPGA (Field Programmable Gate Array) designed for applications that demand high-speed digital processing and versatile connectivity. This component is part of the Virtex-II series, known for its enhanced performance in logic, memory, and I/O capabilities. The XC2V3000-5FG676I excels in environments where flexibility and adaptability are paramount, enabling significant customization to meet specific design requirements. Its robust configuration in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package allows for efficient space utilization and superior signal integrity, making it an ideal choice for complex digital systems.
XC2V3000-5FG676I Features
The XC2V3000-5FG676I FPGA offers a range of features that make it a top contender in its class. It includes 484 I/O pins, providing extensive interfacing capabilities. The device supports a variety of logic functions and has a high logic capacity, which is critical for implementing complex algorithms and system-level designs. Furthermore, its high-speed DSP slices enhance processing power for real-time applications, ensuring reliable and efficient performance across a range of uses.
XC2V3000-5FG676I Applications
- Telecommunications: Used in routers and switches, the XC2V3000-5FG676I manages high-speed signal processing tasks, improving bandwidth and reducing latency.
- Automotive: Integral in driver assistance systems, this FPGA processes inputs from multiple sensors to provide real-time responses, enhancing vehicle safety and performance.
- Medical Imaging: In medical imaging systems, such as MRI and ultrasound, it performs fast data processing, enabling clearer images and quicker diagnostics.
- Industrial Automation: This FPGA is deployed in control systems where its ability to handle complex algorithms optimizes automation processes and increases factory efficiency.
- Consumer Electronics: Used in high-definition video devices, it supports advanced video processing techniques that ensure high-quality output in streaming devices and gaming consoles.
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