XC2V3000-5FFG1152C
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- Mfr.Part #
- XC2V3000-5FFG1152C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 720 I/O 1152FCBGA
- Stock
- 37,241
- In Stock ：
- 37,241
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Series :
- Virtex®-II
- Mounting Type :
- Surface Mount
- Package / Case :
- 1152-BBGA, FCBGA
- Number of Gates :
- 3000000
- Number of Pins :
- 1152
- RoHS Status :
- RoHS Compliant
- Radiation Hardening :
- No
- ECCN Code :
- EAR99
- Base Part Number :
- XC2V3000
- Mount :
- Surface Mount
- Number of Registers :
- 28672
- Operating Temperature :
- 0°C~85°C TJ
- Number of I/O :
- 720
- RAM Size :
- 216kB
- Operating Supply Voltage :
- 1.5V
- Pbfree Code :
- yes
- Total RAM Bits :
- 1769472
- Published :
- 2007
- Packaging :
- Tray
- Voltage - Supply :
- 1.425V~1.575V
- Number of LABs/CLBs :
- 3584
- Speed Grade :
- 5
- Datasheets
- XC2V3000-5FFG1152C
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FPGAs AMD Xilinx XC2V3000-5FFG1152C Overview
Introducing the robust and high-performance FPGAs AMD Xilinx XC2V3000-5FFG1152C, a cutting-edge Field Programmable Gate Array from AMD Xilinx. This IC is tailored for designers looking for extensive I/O capabilities and substantial logic density to tackle complex applications. With a form factor of 1152FCBGA, the XC2V3000-5FFG1152C provides a versatile platform that supports a wide range of applications from telecommunications to automotive technologies. Its architecture allows for rapid prototyping and customization, making it an ideal choice for projects requiring quick adaptation and high-speed data processing.
XC2V3000-5FFG1152C Features
The XC2V3000-5FFG1152C FPGA is designed to deliver superior performance and flexibility with the following features:
- 720 I/O pins for comprehensive external connectivity.
- A compact 1152-pin flip-chip ball grid array (FCBGA) package that maximizes board space efficiency.
- High integration capability suitable for multi-functional devices and complex digital systems.
- Programmable logic cells that enable the customization of the chip's functionality to meet specific application needs.
XC2V3000-5FFG1152C Applications
- Telecommunications Equipment: Used for signal processing, routing, and network management to enhance communication efficiency and reliability.
- Automotive Systems: Integrates into safety mechanisms, infotainment systems, and control units, providing flexible and reliable computing power.
- Consumer Electronics: Powers advanced consumer devices such as smart TVs and gaming consoles, ensuring top-level performance and interactive experiences.
- Industrial Automation: Drives automation systems, providing robust control and monitoring capabilities that are essential in modern industrial environments.
- Medical Devices: Serves as the processing core in critical medical imaging and diagnostic equipment, supporting complex algorithms necessary for detailed imaging and data analysis.
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