XC2V3000-5FF1152I

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Mfr.Part #
XC2V3000-5FF1152I
Manufacturer
AMD Xilinx
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 720 I/O 1152FCBGA
Stock
1,939
In Stock :
1,939

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of I/O :
720
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of Gates :
3000000
Number of Registers :
28672
Combinatorial Delay of a CLB-Max :
0.39 ns
Terminal Form :
Ball
Published :
2007
Radiation Hardening :
No
Mount :
Surface Mount
Supply Voltage :
1.5V
RAM Size :
216kB
Packaging :
Tray
ECCN Code :
3A001.A.7.A
Height Seated (Max) :
3.4mm
RoHS Status :
Non-RoHS Compliant
Series :
Virtex®-II
Total RAM Bits :
1769472
Operating Temperature :
-40°C~100°C TJ
Number of Outputs :
720
Pbfree Code :
No
Base Part Number :
XC2V3000
Number of Pins :
1152
JESD-609 Code :
e0
Peak Reflow Temperature (Cel) :
225
Operating Supply Voltage :
1.5V
Terminal Finish :
Tin/Lead (Sn63Pb37)
Number of LABs/CLBs :
3584
Terminal Pitch :
1mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Voltage - Supply :
1.425V~1.575V
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Position :
BOTTOM
Mounting Type :
Surface Mount
Speed Grade :
5
Package / Case :
1152-BBGA, FCBGA
Datasheets
XC2V3000-5FF1152I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V3000-5FF1152I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Base Part Number:XC2V3000, Number of Pins:1152, Mounting Type:Surface Mount, Package / Case:1152-BBGA, FCBGA, XC2V3000-5FF1152I pinout, XC2V3000-5FF1152I datasheet PDF, XC2V3000-5FF1152I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V3000-5FF1152I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V3000-5FF1152I


FPGAs AMD Xilinx XC2V3000-5FF1152I Overview

The FPGAs AMD Xilinx XC2V3000-5FF1152I is a high-performance, field-programmable gate array that delivers exceptional processing power and flexibility. Designed by AMD Xilinx, a leader in digital circuit technology, this FPGA is tailored to meet the demanding requirements of modern digital applications. The IC FPGA 720 I/O 1152FCBGA format ensures a broad range of connectivity options, making it a versatile choice for developers looking to push the boundaries of hardware acceleration and system integration. Its advanced feature set enables efficient design cycles and rapid deployment of complex algorithms directly into silicon, offering a pivotal advantage in competitive and fast-evolving markets.

XC2V3000-5FF1152I Features

This robust FPGA offers numerous features that make it a superior choice for developers and engineers:

  • 720 input/output options for extensive peripheral and high-speed interfacing.
  • Packaged in a compact 1152-pin flip-chip ball grid array (FCBGA), optimizing board space and enhancing signal integrity.
  • Optimized for power efficiency, reducing operational costs and thermal output.
  • High configurability and the ability to handle complex logic operations and data processing tasks.

XC2V3000-5FF1152I Applications

  • Telecommunications Equipment: This FPGA is ideal for managing complex signal processing tasks, enhancing data flow and communication reliability in network hardware.
  • Automotive Systems: Integrates into driver assistance systems, providing the processing power needed for sensor data interpretation and real-time decision-making.
  • Medical Imaging Devices: Supports the high-speed, high-resolution processing requirements necessary for advanced medical imaging techniques like MRI and CT scans.
  • Industrial Automation: Facilitates improved control and efficiency in automated manufacturing systems, handling multiple control tasks seamlessly and reliably.
  • Aerospace and Defense: Critical for applications requiring rugged, high-performance computing capabilities that can withstand extreme environmental conditions and perform a variety of military-grade tasks.
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