XC2V3000-4FFG1152I

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Mfr.Part #
XC2V3000-4FFG1152I
Manufacturer
AMD Xilinx
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 720 I/O 1152FCBGA
Stock
16,680
In Stock :
16,680

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Operating Supply Voltage :
1.5V
Number of Pins :
1152
RoHS Status :
RoHS Compliant
Packaging :
Tray
Voltage - Supply :
1.425V~1.575V
Package / Case :
1152-BBGA, FCBGA
Base Part Number :
XC2V3000
Total RAM Bits :
1769472
Speed Grade :
4
Number of Registers :
28672
Mount :
Surface Mount
Operating Temperature :
-40°C~100°C TJ
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of I/O :
720
Number of LABs/CLBs :
3584
Published :
2004
Number of Gates :
3000000
Mounting Type :
Surface Mount
RAM Size :
216kB
Pbfree Code :
yes
Series :
Virtex®-II
Radiation Hardening :
No
ECCN Code :
EAR99
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V3000-4FFG1152I from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:1152, Package / Case:1152-BBGA, FCBGA, Base Part Number:XC2V3000, Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, XC2V3000-4FFG1152I pinout, XC2V3000-4FFG1152I datasheet PDF, XC2V3000-4FFG1152I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V3000-4FFG1152I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V3000-4FFG1152I


FPGAs AMD Xilinx XC2V3000-4FFG1152I Overview

The FPGAs AMD Xilinx XC2V3000-4FFG1152I represents a cutting-edge field programmable gate array (FPGA) that offers a robust platform for complex digital circuit development. Designed by AMD Xilinx, a leader in digital design technologies, this FPGA is optimized for high-performance applications requiring rapid prototyping and scalable integration. With its high I/O capability and compact 1152FCBGA packaging, the XC2V3000-4FFG1152I is ideal for developers looking to push the boundaries of innovation in hardware design. Its versatility and advanced features ensure it meets the needs of a wide array of industrial applications, making it a preferred choice for engineers and designers seeking efficiency and scalability.

XC2V3000-4FFG1152I Features

  • 720 I/O Pins: Provides extensive interfacing capabilities, enabling complex and versatile system designs.
  • 1152 Flip-Chip Ball Grid Array (FCBGA) Package: Offers a compact form factor while allowing robust connectivity for high-density circuit designs.
  • High Integration: Supports intricate digital circuit implementations that can optimize both space and power efficiency in system designs.
  • Field Programmable: Allows on-site programming and reprogramming, facilitating iterative development and updates without the need for extensive redesign.

XC2V3000-4FFG1152I Applications

  • Telecommunications Equipment: Used in the development of routers, switches, and other network infrastructure devices, where high I/O count and adaptability are crucial.
  • Automotive Systems: Implements advanced driver-assistance systems (ADAS) and other in-vehicle networking technologies requiring high-speed data processing and reliability.
  • Consumer Electronics: Integral in designing interactive and responsive smart home devices, gaming consoles, and high-performance personal computers.
  • Industrial Automation: Drives the development of robotics and automated control systems that require complex logic operations and real-time processing capabilities.
  • Aerospace and Defense: Employs in mission-critical applications such as satellite communications and avionics systems, where performance and error tolerance are paramount.
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