XC2V3000-4FFG1152I
- Mfr.Part #
- XC2V3000-4FFG1152I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 720 I/O 1152FCBGA
- Stock
- 16,680
- In Stock :
- 16,680
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Operating Supply Voltage :
- 1.5V
- Number of Pins :
- 1152
- RoHS Status :
- RoHS Compliant
- Packaging :
- Tray
- Voltage - Supply :
- 1.425V~1.575V
- Package / Case :
- 1152-BBGA, FCBGA
- Base Part Number :
- XC2V3000
- Total RAM Bits :
- 1769472
- Speed Grade :
- 4
- Number of Registers :
- 28672
- Mount :
- Surface Mount
- Operating Temperature :
- -40°C~100°C TJ
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of I/O :
- 720
- Number of LABs/CLBs :
- 3584
- Published :
- 2004
- Number of Gates :
- 3000000
- Mounting Type :
- Surface Mount
- RAM Size :
- 216kB
- Pbfree Code :
- yes
- Series :
- Virtex®-II
- Radiation Hardening :
- No
- ECCN Code :
- EAR99
- Datasheets
- XC2V3000-4FFG1152I
FPGAs AMD Xilinx XC2V3000-4FFG1152I Overview
The FPGAs AMD Xilinx XC2V3000-4FFG1152I represents a cutting-edge field programmable gate array (FPGA) that offers a robust platform for complex digital circuit development. Designed by AMD Xilinx, a leader in digital design technologies, this FPGA is optimized for high-performance applications requiring rapid prototyping and scalable integration. With its high I/O capability and compact 1152FCBGA packaging, the XC2V3000-4FFG1152I is ideal for developers looking to push the boundaries of innovation in hardware design. Its versatility and advanced features ensure it meets the needs of a wide array of industrial applications, making it a preferred choice for engineers and designers seeking efficiency and scalability.
XC2V3000-4FFG1152I Features
- 720 I/O Pins: Provides extensive interfacing capabilities, enabling complex and versatile system designs.
- 1152 Flip-Chip Ball Grid Array (FCBGA) Package: Offers a compact form factor while allowing robust connectivity for high-density circuit designs.
- High Integration: Supports intricate digital circuit implementations that can optimize both space and power efficiency in system designs.
- Field Programmable: Allows on-site programming and reprogramming, facilitating iterative development and updates without the need for extensive redesign.
XC2V3000-4FFG1152I Applications
- Telecommunications Equipment: Used in the development of routers, switches, and other network infrastructure devices, where high I/O count and adaptability are crucial.
- Automotive Systems: Implements advanced driver-assistance systems (ADAS) and other in-vehicle networking technologies requiring high-speed data processing and reliability.
- Consumer Electronics: Integral in designing interactive and responsive smart home devices, gaming consoles, and high-performance personal computers.
- Industrial Automation: Drives the development of robotics and automated control systems that require complex logic operations and real-time processing capabilities.
- Aerospace and Defense: Employs in mission-critical applications such as satellite communications and avionics systems, where performance and error tolerance are paramount.
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