XC2V250-6FGG456C
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- Mfr.Part #
- XC2V250-6FGG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 200 I/O 456FBGA
- Stock
- 9,418
- In Stock ：
- 9,418
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Voltage - Supply :
- 1.425V~1.575V
- RoHS Status :
- RoHS Compliant
- Mounting Type :
- Surface Mount
- Length :
- 23mm
- Mount :
- Surface Mount
- Number of Registers :
- 3072
- Supply Voltage :
- 1.5V
- Number of I/O :
- 200
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Radiation Hardening :
- No
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Gates :
- 250000
- Power Supplies :
- 1.51.5/3.33.3V
- HTS Code :
- 8542.39.00.01
- Total RAM Bits :
- 442368
- Packaging :
- Tray
- Pbfree Code :
- yes
- Number of LABs/CLBs :
- 384
- Number of Pins :
- 456
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Speed Grade :
- 6
- Number of Terminations :
- 456
- ECCN Code :
- 3A991.D
- RAM Size :
- 54kB
- Number of CLBs :
- 384
- Peak Reflow Temperature (Cel) :
- 250
- Series :
- Virtex®-II
- Operating Supply Voltage :
- 1.5V
- Operating Temperature :
- 0°C~85°C TJ
- Width :
- 23mm
- Published :
- 2007
- Package / Case :
- 456-BBGA
- Combinatorial Delay of a CLB-Max :
- 0.35 ns
- Base Part Number :
- XC2V250
- Clock Frequency :
- 820MHz
- JESD-609 Code :
- e1
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Form :
- Ball
- Pin Count :
- 456
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- Number of Outputs :
- 200
- Datasheets
- XC2V250-6FGG456C
FPGAs AMD Xilinx XC2V250-6FGG456C Overview
The AMD Xilinx XC2V250-6FGG456C FPGA stands at the forefront of modern programmable logic technology. Offering a blend of versatile features and robust performance, this FPGA from AMD Xilinx is designed to cater to demanding applications that require rapid processing and high-density integration. This FPGA's architecture allows it to be programmed for a variety of uses, ranging from complex digital computations to high-speed data processing tasks. The integration of 200 I/Os within a compact 456 FBGA package ensures that it can handle multiple inputs and outputs efficiently, making it a prime choice for developers looking to harness the power of a flexible and powerful computing solution.
XC2V250-6FGG456C Features
The XC2V250-6FGG456C FPGA includes several key features that make it ideal for a wide range of applications. Key features include a high I/O count of 200, which provides substantial connectivity for various peripheral devices. The FPGA's compact 456-ball fine-pitch BGA (FBGA) package ensures a minimal footprint on system boards, which is crucial for dense circuit designs. Furthermore, its reprogrammability offers unmatched flexibility in hardware design, allowing changes to be made to the system functionality without needing to alter the physical hardware.
XC2V250-6FGG456C Applications
- Telecommunications Infrastructure: Used for signal processing and data flow management within networks, enhancing connectivity and reliability.
- Automotive Safety Systems: Integrates into safety mechanisms like collision detection and automatic braking systems, providing rapid response capabilities.
- Consumer Electronics: Serves as the core processing unit in devices like high-definition televisions and gaming consoles, handling complex graphics and user inputs smoothly.
- Medical Imaging Equipment: Processes large datasets in medical imaging devices, facilitating quicker and more accurate diagnostic capabilities.
- Industrial Automation: Controls machinery and processes in manufacturing settings, increasing efficiency and precision in high-volume environments.
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