XC2V250-6FGG456C
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- Mfr.Part #
- XC2V250-6FGG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 200 I/O 456FBGA
- Stock
- 9,418
- In Stock ：
- 9,418
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Pins :
- 456
- Supply Voltage :
- 1.5V
- Peak Reflow Temperature (Cel) :
- 250
- Operating Temperature :
- 0°C~85°C TJ
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- ECCN Code :
- 3A991.D
- Number of Registers :
- 3072
- Terminal Form :
- Ball
- Mounting Type :
- Surface Mount
- Number of CLBs :
- 384
- JESD-609 Code :
- e1
- Published :
- 2007
- Power Supplies :
- 1.51.5/3.33.3V
- Number of LABs/CLBs :
- 384
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Speed Grade :
- 6
- Terminal Pitch :
- 1mm
- Package / Case :
- 456-BBGA
- Radiation Hardening :
- No
- Combinatorial Delay of a CLB-Max :
- 0.35 ns
- RoHS Status :
- RoHS Compliant
- Width :
- 23mm
- Number of Outputs :
- 200
- Length :
- 23mm
- Terminal Position :
- BOTTOM
- Clock Frequency :
- 820MHz
- RAM Size :
- 54kB
- Number of Gates :
- 250000
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Series :
- Virtex®-II
- Number of I/O :
- 200
- HTS Code :
- 8542.39.00.01
- Voltage - Supply :
- 1.425V~1.575V
- Packaging :
- Tray
- Total RAM Bits :
- 442368
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Base Part Number :
- XC2V250
- Operating Supply Voltage :
- 1.5V
- Mount :
- Surface Mount
- Pin Count :
- 456
- Number of Terminations :
- 456
- Pbfree Code :
- yes
- Datasheets
- XC2V250-6FGG456C
FPGAs AMD Xilinx XC2V250-6FGG456C Overview
The AMD Xilinx XC2V250-6FGG456C FPGA stands at the forefront of modern programmable logic technology. Offering a blend of versatile features and robust performance, this FPGA from AMD Xilinx is designed to cater to demanding applications that require rapid processing and high-density integration. This FPGA's architecture allows it to be programmed for a variety of uses, ranging from complex digital computations to high-speed data processing tasks. The integration of 200 I/Os within a compact 456 FBGA package ensures that it can handle multiple inputs and outputs efficiently, making it a prime choice for developers looking to harness the power of a flexible and powerful computing solution.
XC2V250-6FGG456C Features
The XC2V250-6FGG456C FPGA includes several key features that make it ideal for a wide range of applications. Key features include a high I/O count of 200, which provides substantial connectivity for various peripheral devices. The FPGA's compact 456-ball fine-pitch BGA (FBGA) package ensures a minimal footprint on system boards, which is crucial for dense circuit designs. Furthermore, its reprogrammability offers unmatched flexibility in hardware design, allowing changes to be made to the system functionality without needing to alter the physical hardware.
XC2V250-6FGG456C Applications
- Telecommunications Infrastructure: Used for signal processing and data flow management within networks, enhancing connectivity and reliability.
- Automotive Safety Systems: Integrates into safety mechanisms like collision detection and automatic braking systems, providing rapid response capabilities.
- Consumer Electronics: Serves as the core processing unit in devices like high-definition televisions and gaming consoles, handling complex graphics and user inputs smoothly.
- Medical Imaging Equipment: Processes large datasets in medical imaging devices, facilitating quicker and more accurate diagnostic capabilities.
- Industrial Automation: Controls machinery and processes in manufacturing settings, increasing efficiency and precision in high-volume environments.
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