XC2V250-5FGG456C

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Mfr.Part #
XC2V250-5FGG456C
Manufacturer
AMD Xilinx
Package / Case
456-BBGA
Datasheet
Download
Description
IC FPGA 200 I/O 456FBGA
Stock
32,415
In Stock :
32,415

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Position :
BOTTOM
Package / Case :
456-BBGA
Voltage - Supply :
1.425V~1.575V
Mount :
Surface Mount
Pbfree Code :
yes
Number of CLBs :
384
Mounting Type :
Surface Mount
Number of Registers :
3072
Number of Gates :
250000
Operating Supply Voltage :
1.5V
Published :
2007
Width :
23mm
RAM Size :
54kB
Time@Peak Reflow Temperature-Max (s) :
30
Series :
Virtex®-II
Length :
23mm
Pin Count :
456
Operating Temperature :
0°C~85°C TJ
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Height Seated (Max) :
2.6mm
Packaging :
Tray
ECCN Code :
3A991.D
JESD-609 Code :
e1
Number of Pins :
456
Radiation Hardening :
No
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
442368
Number of I/O :
200
Number of Outputs :
200
Speed Grade :
5
Number of Terminations :
456
Base Part Number :
XC2V250
Terminal Form :
Ball
Supply Voltage :
1.5V
Combinatorial Delay of a CLB-Max :
0.39 ns
RoHS Status :
RoHS Compliant
Terminal Pitch :
1mm
Number of LABs/CLBs :
384
Peak Reflow Temperature (Cel) :
250
Datasheets
XC2V250-5FGG456C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V250-5FGG456C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:456-BBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Number of Pins:456, Number of Terminations:456, Base Part Number:XC2V250, XC2V250-5FGG456C pinout, XC2V250-5FGG456C datasheet PDF, XC2V250-5FGG456C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V250-5FGG456C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V250-5FGG456C


FPGAs AMD Xilinx XC2V250-5FGG456C Overview

AMD Xilinx的XC2V250-5FGG456C是高度灵活的现场可编程门阵列(FPGA),提供了200个输入/输出端口,采用456球的FBGA封装。这款产品因其卓越的性能和多功能性而备受业界青睐。其高集成度和低延迟的特性使其成为各种复杂电子系统的理想选择,尤其适用于需要高速处理和自定义逻辑的应用场景。凭借其灵活的可编程性,XC2V250-5FGG456C非常适合对不同硬件配置和功能需求多变的企业客户。作为FPGA领域的领导者,AMD Xilinx以其稳定性和先进技术而闻名,这款产品也是该品牌卓越制造工艺的代表之一。

XC2V250-5FGG456C Features

- **200个输入/输出端口**:提供丰富的接口,适应不同的应用场景。 - **456球FBGA封装**:确保紧凑的设计,适用于高密度电路板。 - **灵活的可编程性**:用户可以根据需求自定义电路,满足特定应用。 - **高性能**:具备快速处理能力,适用于高负荷任务。 - **低功耗**:为能源敏感的应用提供更佳的选择。

XC2V250-5FGG456C Applications

- **通信设备**:适用于高速数据传输和处理,支持灵活的通信协议配置。 - **嵌入式系统**:在嵌入式设备中用作可编程逻辑控制器,满足定制化需求。 - **工业自动化**:提供灵活的控制逻辑,适用于工业自动化领域的复杂流程。 - **消费电子**:用于高性能消费电子产品,实现自定义功能和特色。 - **医疗设备**:支持高精度数据处理和低延迟,是医疗诊断和监控设备的理想选择。
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