XC2V250-5FGG256C

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Mfr.Part #
XC2V250-5FGG256C
Manufacturer
AMD Xilinx
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 172 I/O 256FBGA
Stock
37,232
In Stock :
37,232

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Number of Pins :
256
Number of Terminations :
256
Packaging :
Tray
Terminal Position :
BOTTOM
Operating Supply Voltage :
1.5V
Total RAM Bits :
442368
Number of Registers :
3072
Operating Temperature :
0°C~85°C TJ
Series :
Virtex®-II
RoHS Status :
RoHS Compliant
Voltage - Supply :
1.425V~1.575V
Published :
2007
Mount :
Surface Mount
Number of I/O :
172
Speed Grade :
5
Number of LABs/CLBs :
384
JESD-609 Code :
e1
Base Part Number :
XC2V250
Number of Gates :
250000
Package / Case :
256-BGA
Combinatorial Delay of a CLB-Max :
0.39 ns
Pin Count :
256
Radiation Hardening :
No
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RAM Size :
54kB
Time@Peak Reflow Temperature-Max (s) :
30
ECCN Code :
EAR99
Width :
17mm
Supply Voltage :
1.5V
Peak Reflow Temperature (Cel) :
260
Number of Outputs :
172
Pbfree Code :
yes
Length :
17mm
Number of CLBs :
384
Height Seated (Max) :
2mm
Terminal Pitch :
1mm
Datasheets
XC2V250-5FGG256C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V250-5FGG256C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Pins:256, Number of Terminations:256, Operating Temperature:0°C~85°C TJ, Base Part Number:XC2V250, Package / Case:256-BGA, XC2V250-5FGG256C pinout, XC2V250-5FGG256C datasheet PDF, XC2V250-5FGG256C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V250-5FGG256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V250-5FGG256C


FPGAs AMD Xilinx XC2V250-5FGG256C Overview

The FPGAs AMD Xilinx XC2V250-5FGG256C is a high-performance Field Programmable Gate Array designed for a broad range of applications, requiring efficient and rapid processing capabilities in a compact form factor. This FPGA from AMD Xilinx features a robust 256-pin Fine Ball Grid Array (FBGA) package, which ensures excellent electrical connectivity and heat dissipation, suitable for intensive operations. With 172 programmable I/O pins, this device offers flexibility and scalability, making it an ideal choice for developers looking to push the boundaries of hardware acceleration and system integration. The XC2V250-5FGG256C is engineered to deliver superior performance that meets the demands of complex digital processing tasks, enhancing efficiency and reducing time to market for new products.

XC2V250-5FGG256C Features

The XC2V250-5FGG256C FPGA is equipped with a range of features designed to enhance its usability and functionality in various demanding applications. This includes a large number of I/O pins, a dense 256FBGA package for reliable physical integration, and advanced configuration options that allow for tailored functionality to specific needs. Additionally, its support for multiple logic configurations enables it to be used in a diverse set of applications, further expanding its utility.

XC2V250-5FGG256C Applications

  • Telecommunications: Utilized in communication infrastructure to manage signal processing and data flow, enhancing bandwidth and reducing latency.
  • Automotive: Deployed in advanced driver-assistance systems (ADAS) to process real-time sensor data, facilitating safer driving experiences.
  • Consumer Electronics: Integrated into smart home devices, allowing for sophisticated control and connectivity solutions that enhance user interaction and functionality.
  • Industrial: Used in automated manufacturing systems to control machinery with precision, improving operational efficiency and safety.
  • Medical Devices: Applied in medical imaging systems to process complex data sets swiftly, ensuring high-resolution imaging critical for accurate diagnostics.
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