XC2V2000-6FFG896C
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- Mfr.Part #
- XC2V2000-6FFG896C
- Manufacturer
- AMD Xilinx
- Package / Case
- 896-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 624 I/O 896FCBGA
- Stock
- 43,219
- In Stock ：
- 43,219
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of I/O :
- 624
- Base Part Number :
- XC2V2000
- Package / Case :
- 896-BBGA, FCBGA
- Operating Supply Voltage :
- 1.5V
- Pin Count :
- 896
- Terminal Position :
- BOTTOM
- Published :
- 2006
- JESD-609 Code :
- e1
- Total RAM Bits :
- 1032192
- Number of Registers :
- 21504
- Power Supplies :
- 1.51.5/3.33.3V
- Number of Gates :
- 2000000
- Number of Terminations :
- 896
- Number of Outputs :
- 624
- Radiation Hardening :
- No
- Supply Voltage :
- 1.5V
- RAM Size :
- 126kB
- Combinatorial Delay of a CLB-Max :
- 0.35 ns
- Mount :
- Surface Mount
- Width :
- 31mm
- Speed Grade :
- 6
- Terminal Pitch :
- 1mm
- Number of LABs/CLBs :
- 2688
- Length :
- 31mm
- Pbfree Code :
- yes
- Terminal Form :
- Ball
- Clock Frequency :
- 820MHz
- HTS Code :
- 8542.39.00.01
- Height Seated (Max) :
- 3.4mm
- Series :
- Virtex®-II
- Number of Logic Cells :
- 24192
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Operating Temperature :
- 0°C~85°C TJ
- Number of Pins :
- 896
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- RoHS Status :
- RoHS Compliant
- ECCN Code :
- EAR99
- Mounting Type :
- Surface Mount
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Peak Reflow Temperature (Cel) :
- 245
- Packaging :
- Tray
- Voltage - Supply :
- 1.425V~1.575V
- Datasheets
- XC2V2000-6FFG896C
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FPGAs AMD Xilinx XC2V2000-6FFG896C Overview
The FPGAs AMD Xilinx XC2V2000-6FFG896C is a highly versatile and powerful integrated circuit designed to meet the demanding requirements of modern digital systems. Manufactured by AMD Xilinx, a leader in digital circuit technology, this FPGA (Field Programmable Gate Array) enables engineers and developers to achieve significant performance improvements in a variety of applications. The XC2V2000-6FFG896C is housed in an 896-pin flip-chip BGA (FCBGA) package, offering a robust platform for complex system integrations. Its large number of I/O options and high-speed data processing capabilities make it ideal for high-performance tasks requiring extensive programmability and adaptability.
XC2V2000-6FFG896C Features
This FPGA is equipped with 624 I/O pins, providing ample connectivity for multiple peripherals and external devices. The XC2V2000-6FFG896C supports a wide array of design implementations, benefiting from its high-density logic cells that facilitate complex digital computations and signal processing tasks. This component is especially suited for applications requiring high-speed data transfers and significant logic capacity, all within a compact and energy-efficient module.
XC2V2000-6FFG896C Applications
- Telecommunications: Utilized in communication infrastructure to manage signal processing and data flow, enhancing bandwidth and reducing latency.
- Consumer Electronics: Integral to advanced consumer electronics such as smart TVs and gaming consoles, where high-speed processing enhances user experience.
- Automotive: Employs sophisticated control systems for driver assistance technologies, ensuring reliable and rapid processing in safety-critical applications.
- Industrial Automation: Forms the backbone of automated manufacturing systems, improving operational efficiency and precision in complex industrial environments.
- Medical Devices: Critical in medical imaging systems, facilitating real-time data processing for accurate diagnostics and treatment planning.
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