XC2V2000-6BGG575C
- Mfr.Part #
- XC2V2000-6BGG575C
- Manufacturer
- AMD Xilinx
- Package / Case
- 575-BBGA
- Datasheet
- Download
- Description
- IC FPGA 408 I/O 575BGA
- Stock
- 44,354
- In Stock :
- 44,354
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Terminations :
- 575
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Length :
- 31mm
- Base Part Number :
- XC2V2000
- Operating Temperature :
- 0°C~85°C TJ
- Package / Case :
- 575-BBGA
- Peak Reflow Temperature (Cel) :
- 250
- Speed Grade :
- 6
- Terminal Finish :
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Mount :
- Surface Mount
- Number of Outputs :
- 408
- Power Supplies :
- 1.51.5/3.33.3V
- Supply Voltage :
- 1.5V
- Packaging :
- Tray
- Number of Gates :
- 2000000
- Operating Supply Voltage :
- 1.5V
- Number of Logic Cells :
- 24192
- Published :
- 2007
- RAM Size :
- 126kB
- HTS Code :
- 8542.39.00.01
- RoHS Status :
- RoHS Compliant
- JESD-609 Code :
- e1
- Combinatorial Delay of a CLB-Max :
- 0.35 ns
- Mounting Type :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Terminal Position :
- BOTTOM
- Number of LABs/CLBs :
- 2688
- Width :
- 31mm
- Series :
- Virtex®-II
- Clock Frequency :
- 820MHz
- Voltage - Supply :
- 1.425V~1.575V
- Total RAM Bits :
- 1032192
- Number of I/O :
- 408
- ECCN Code :
- 3A991.D
- Terminal Form :
- Ball
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Registers :
- 21504
- Terminal Pitch :
- 1.27mm
- Radiation Hardening :
- No
- Number of Pins :
- 575
- Pin Count :
- 575
- Pbfree Code :
- yes
- Datasheets
- XC2V2000-6BGG575C

FPGAs AMD Xilinx XC2V2000-6BGG575C Overview
The FPGAs AMD Xilinx XC2V2000-6BGG575C is a high-performance, field-programmable gate array designed for advanced integrated circuits applications. Manufactured by AMD Xilinx, a leader in programmable logic solutions, this FPGA offers a robust platform for developers looking to deploy sophisticated designs and achieve rapid prototyping. This device encapsulates cutting-edge technology with its 575-ball grid array package, allowing for a significant number of I/O options and flexible system integration. The XC2V2000-6BGG575C is ideal for those requiring high-speed data processing and extensive logic computations across various industries, ensuring both scalability and adaptability in complex electronic environments.
XC2V2000-6BGG575C Features
The XC2V2000-6BGG575C FPGA features 408 I/O pins which provide extensive connectivity and interface options. Its 575-ball BGA (Ball Grid Array) packaging ensures a compact footprint while offering robust performance in high-density applications. This FPGA is built to handle complex digital computations efficiently, making it a versatile choice for designers looking to leverage high-speed signal processing capabilities. Its reprogrammable gate array configuration allows for iterative testing and development, significantly reducing time-to-market for electronic products.
XC2V2000-6BGG575C Applications
- Data Centers: Utilized for managing high-speed data operations, facilitating efficient data storage, and processing solutions in server farms and storage area networks.
- Telecommunications: Employs its vast I/O capabilities to support infrastructure for signal processing, network routers, and switch management, enhancing data transmission reliability and speed.
- Aerospace and Defense: Applied in satellite communications for its robust processing capabilities in harsh environments, ensuring reliable data handling and transmission.
- Medical Imaging: Integral in advanced medical imaging equipment, helping in the rapid processing of complex imaging data, thus improving diagnostic capabilities and patient outcomes.
- Automotive: Supports advanced driver-assistance systems (ADAS) by processing multiple inputs from vehicle sensors, improving safety and driving experience.
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