XC2V2000-6BGG575C

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Mfr.Part #
XC2V2000-6BGG575C
Manufacturer
AMD Xilinx
Package / Case
575-BBGA
Datasheet
Download
Description
IC FPGA 408 I/O 575BGA
Stock
44,354
In Stock :
44,354

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Terminations :
575
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Length :
31mm
Base Part Number :
XC2V2000
Operating Temperature :
0°C~85°C TJ
Package / Case :
575-BBGA
Peak Reflow Temperature (Cel) :
250
Speed Grade :
6
Terminal Finish :
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Mount :
Surface Mount
Number of Outputs :
408
Power Supplies :
1.51.5/3.33.3V
Supply Voltage :
1.5V
Packaging :
Tray
Number of Gates :
2000000
Operating Supply Voltage :
1.5V
Number of Logic Cells :
24192
Published :
2007
RAM Size :
126kB
HTS Code :
8542.39.00.01
RoHS Status :
RoHS Compliant
JESD-609 Code :
e1
Combinatorial Delay of a CLB-Max :
0.35 ns
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
40
Terminal Position :
BOTTOM
Number of LABs/CLBs :
2688
Width :
31mm
Series :
Virtex®-II
Clock Frequency :
820MHz
Voltage - Supply :
1.425V~1.575V
Total RAM Bits :
1032192
Number of I/O :
408
ECCN Code :
3A991.D
Terminal Form :
Ball
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Registers :
21504
Terminal Pitch :
1.27mm
Radiation Hardening :
No
Number of Pins :
575
Pin Count :
575
Pbfree Code :
yes
Datasheets
XC2V2000-6BGG575C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V2000-6BGG575C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:575, Base Part Number:XC2V2000, Operating Temperature:0°C~85°C TJ, Package / Case:575-BBGA, Mounting Type:Surface Mount, Number of Pins:575, XC2V2000-6BGG575C pinout, XC2V2000-6BGG575C datasheet PDF, XC2V2000-6BGG575C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2V2000-6BGG575C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2V2000-6BGG575C


FPGAs AMD Xilinx XC2V2000-6BGG575C Overview

The FPGAs AMD Xilinx XC2V2000-6BGG575C is a high-performance, field-programmable gate array designed for advanced integrated circuits applications. Manufactured by AMD Xilinx, a leader in programmable logic solutions, this FPGA offers a robust platform for developers looking to deploy sophisticated designs and achieve rapid prototyping. This device encapsulates cutting-edge technology with its 575-ball grid array package, allowing for a significant number of I/O options and flexible system integration. The XC2V2000-6BGG575C is ideal for those requiring high-speed data processing and extensive logic computations across various industries, ensuring both scalability and adaptability in complex electronic environments.

XC2V2000-6BGG575C Features

The XC2V2000-6BGG575C FPGA features 408 I/O pins which provide extensive connectivity and interface options. Its 575-ball BGA (Ball Grid Array) packaging ensures a compact footprint while offering robust performance in high-density applications. This FPGA is built to handle complex digital computations efficiently, making it a versatile choice for designers looking to leverage high-speed signal processing capabilities. Its reprogrammable gate array configuration allows for iterative testing and development, significantly reducing time-to-market for electronic products.

XC2V2000-6BGG575C Applications

  • Data Centers: Utilized for managing high-speed data operations, facilitating efficient data storage, and processing solutions in server farms and storage area networks.
  • Telecommunications: Employs its vast I/O capabilities to support infrastructure for signal processing, network routers, and switch management, enhancing data transmission reliability and speed.
  • Aerospace and Defense: Applied in satellite communications for its robust processing capabilities in harsh environments, ensuring reliable data handling and transmission.
  • Medical Imaging: Integral in advanced medical imaging equipment, helping in the rapid processing of complex imaging data, thus improving diagnostic capabilities and patient outcomes.
  • Automotive: Supports advanced driver-assistance systems (ADAS) by processing multiple inputs from vehicle sensors, improving safety and driving experience.
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