XAZU7EV-1FBVB900I

Manufacturer :

AMD Xilinx

Product Category :

System On Chip (SoC)

Package :

Tray

Operating Temperature :

-40°C ~ 100°C (TJ)

Supplier Device Package :

900-FCBGA (31x31)

RAM Size :

256KB

Package / Case :

FCBGA-900

Number of Cores :

7 Core

Architecture :

MCU, FPGA

Number of I/Os :

204 I/O

Peripherals :

DMA, WDT

Series :

XAZU7EV

RoHS :

Details

Maximum Operating Temperature :

+ 100 C

Connectivity :

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Primary Attributes :

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

Product Type :

SoC FPGA

Operating Supply Voltage :

0.85 V

Program Memory Size :

-

Manufacturer :

Xilinx

Product Status :

Active

Number of Transceivers :

16 Transceiver

Tradename :

Zynq

Flash Size :

-

Speed :

500MHz, 600MHz, 1.2GHz

Product Category :

SoC FPGA

Brand :

Xilinx

Subcategory :

SOC - Systems on a Chip

Mounting Style :

SMD/SMT

Number of I/O :

220

Core Processor :

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Minimum Operating Temperature :

- 40 C