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  6. XAZU2EG-1SFVA625I
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    Mfr.Part #
    XAZU2EG-1SFVA625I
    Manufacturer
    AMD Xilinx
    Package / Case
    625-BFBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 625FCBGA
    Stock
    5,679
    In Stock ：
    5,679

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Width :
    21mm
    Terminal Form :
    Ball
    Height Seated (Max) :
    3.43mm
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Package / Case :
    625-BFBGA, FCBGA
    RoHS Status :
    ROHS3 Compliant
    uPs/uCs/Peripheral ICs Type :
    MICROPROCESSOR CIRCUIT
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Number of Terminations :
    625
    Peripherals :
    DMA, WDT
    Architecture :
    MPU, FPGA
    Number of I/O :
    128
    Length :
    21mm
    Packaging :
    Tray
    Terminal Position :
    BOTTOM
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Operating Temperature :
    -40°C~100°C TJ
    RAM Size :
    1.2MB
    Terminal Pitch :
    0.8mm
    Speed :
    500MHz, 1.2GHz
    Series :
    Zynq® UltraScale+™ MPSoC EG
    Supply Voltage :
    0.85V
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Factory Lead Time :
    11 Weeks
    HTS Code :
    8542.31.00.01
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    JESD-30 Code :
    S-PBGA-B625
    Surface Mount :
    yes
    Datasheets
    XAZU2EG-1SFVA625I
    Introducing System On Chip (SoC) AMD Xilinx XAZU2EG-1SFVA625I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：625-BFBGA, FCBGA, Number of Terminations：625, Operating Temperature：-40°C~100°C TJ, XAZU2EG-1SFVA625I pinout, XAZU2EG-1SFVA625I datasheet PDF, XAZU2EG-1SFVA625I amp .Beyond System On Chip (SoC) AMD Xilinx XAZU2EG-1SFVA625I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XAZU2EG-1SFVA625I


    625 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 128 I/O 0.85V

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


    A core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 625-BFBGA, FCBGA.With 1.2MB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MPU, FPGA architecture for its internal architecture.Zynq® UltraScale+™ MPSoC EG is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Zynq®UltraScale+™ FPGA, 103K+ Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.128 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 0.85V.In total, there are 625 terminations, so system on a chip is really aided by this.MICROPROCESSOR CIRCUIT is its uPs/uCs/peripheral IC and is used in all of its peripheral SoC meanings.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


    1.2MB RAM.
    Built on MPU, FPGA.
    MICROPROCESSOR CIRCUIT


    There are a lot of Xilinx Inc.


    XAZU2EG-1SFVA625I System On Chip (SoC) applications.


    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
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