XAZU2EG-1SBVA484Q
- Mfr.Part #
- XAZU2EG-1SBVA484Q
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-BFBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A53 484FCBGA
- Stock
- 6,891
- In Stock :
- 6,891
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Peripherals :
- DMA, WDT
- Supply Voltage :
- 0.85V
- Primary Attributes :
- Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
- Package / Case :
- 484-BFBGA, FCBGA
- Terminal Pitch :
- 0.8mm
- Speed :
- 500MHz, 1.2GHz
- Series :
- Zynq® UltraScale+™ MPSoC EG
- Factory Lead Time :
- 11 Weeks
- Surface Mount :
- yes
- Length :
- 19mm
- Number of I/O :
- 128
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Packaging :
- Tray
- Width :
- 19mm
- Terminal Position :
- BOTTOM
- HTS Code :
- 8542.31.00.01
- RAM Size :
- 1.2MB
- Number of Terminations :
- 484
- JESD-30 Code :
- S-PBGA-B484
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Architecture :
- MPU, FPGA
- RoHS Status :
- ROHS3 Compliant
- Core Processor :
- Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- Operating Temperature :
- -40°C~125°C TJ
- Terminal Form :
- Ball
- Height Seated (Max) :
- 2.61mm
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Datasheets
- XAZU2EG-1SBVA484Q

484 Terminations -40°C~125°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 128 I/O 0.85V
This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is used to build this SoC.Its package is 484-BFBGA, FCBGA.A 1.2MB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MPU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+™ MPSoC EG series.For this SoC meaning, the average operating temperature should be -40°C~125°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 103K+ Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 128.A 0.85V power supply should be used.Having 484 terminations in total makes system on a chip possible.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
1.2MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XAZU2EG-1SBVA484Q System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
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