XAZU2EG-1SBVA484Q

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Mfr.Part #
XAZU2EG-1SBVA484Q
Manufacturer
AMD Xilinx
Package / Case
484-BFBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 484FCBGA
Stock
6,891
In Stock :
6,891

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Peripherals :
DMA, WDT
Supply Voltage :
0.85V
Primary Attributes :
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Package / Case :
484-BFBGA, FCBGA
Terminal Pitch :
0.8mm
Speed :
500MHz, 1.2GHz
Series :
Zynq® UltraScale+™ MPSoC EG
Factory Lead Time :
11 Weeks
Surface Mount :
yes
Length :
19mm
Number of I/O :
128
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Packaging :
Tray
Width :
19mm
Terminal Position :
BOTTOM
HTS Code :
8542.31.00.01
RAM Size :
1.2MB
Number of Terminations :
484
JESD-30 Code :
S-PBGA-B484
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture :
MPU, FPGA
RoHS Status :
ROHS3 Compliant
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Operating Temperature :
-40°C~125°C TJ
Terminal Form :
Ball
Height Seated (Max) :
2.61mm
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Datasheets
XAZU2EG-1SBVA484Q
Introducing System On Chip (SoC) AMD Xilinx XAZU2EG-1SBVA484Q from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:484-BFBGA, FCBGA, Number of Terminations:484, Operating Temperature:-40°C~125°C TJ, XAZU2EG-1SBVA484Q pinout, XAZU2EG-1SBVA484Q datasheet PDF, XAZU2EG-1SBVA484Q amp .Beyond System On Chip (SoC) AMD Xilinx XAZU2EG-1SBVA484Q ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XAZU2EG-1SBVA484Q


484 Terminations -40°C~125°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 128 I/O 0.85V

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is used to build this SoC.Its package is 484-BFBGA, FCBGA.A 1.2MB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MPU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+™ MPSoC EG series.For this SoC meaning, the average operating temperature should be -40°C~125°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 103K+ Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 128.A 0.85V power supply should be used.Having 484 terminations in total makes system on a chip possible.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


1.2MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XAZU2EG-1SBVA484Q System On Chip (SoC) applications.


  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
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